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International Journal of Thermophysics

Volumn 31, Issue 6, 2010, Pages 1145-1156

Experimental investigation of the thermal impedance of interstitial material at a junction

(4) Wang, Jianli a Gu, Ming a Song, Bai a Zhang, Xing a

a TSINGHUA UNIVERSITY (China)

Author keywords

Interstitial material; Quasi steady state T type probe; Thermal effusivity; Thermal impedance

Indexed keywords

ALTERNATING CURRENT; COMPLEX RATIO; CU WIRES; EXPERIMENTAL EVIDENCE; EXPERIMENTAL INVESTIGATIONS; HIGH THERMAL; HOT WIRES; INTERSTITIAL MATERIALS; MICRO-SCALES; PLATINUM BLACK; QUASI-STEADY STATE; RADIATION HEAT LOSS; SHORT HOT WIRE; STEADY-STATE THERMAL RESISTANCE; TEST WIRES; THERMAL EFFUSIVITY; THERMAL IMPEDANCE; THERMAL RESISTANCE;

ELECTRONICS PACKAGING; PLATINUM; RADIATION EFFECTS; WIRE;

PROBES;

EID: 78149282264 PISSN: 0195928X EISSN: None Source Type: Journal
DOI: 10.1007/s10765-010-0807-8 Document Type: Article

Times cited : (7)

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