Poly(3-hexylthiophene) wrapped carbon nanotube/poly(dimethylsiloxane) composites for use in finger-sensing piezoresistive pressure sensors

Carbon

Volumn 49, Issue 1, 2011, Pages 106-110

  Hwang, Jihun ^a   Jang, Jaeyoung ^a   Hong, Kipyo ^a   Kim, Kun Nyun ^b   Han, Jong Hun ^b   Shin, Kwonwoo ^b   Park, Chan Eon ^a  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

^b Korea Electronic Technology Institute (KETI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE FILLERS; DIMETHYLSILOXANE; ELECTRICAL CONDUCTIVITY; HOMOGENEOUS DISPERSIONS; PERCOLATION THRESHOLDS; PIEZO-RESISTIVE; PIEZORESISTIVE COMPOSITES; PIEZORESISTIVE PRESSURE SENSORS; POLY-3-HEXYLTHIOPHENE; POLYDIMETHYLSILOXANE PDMS; POLYMER WRAPPING; PRESSURE RANGES; WELL-DISPERSED;

CARRIER MOBILITY; ELECTRIC CONDUCTIVITY; FILLED POLYMERS; MICROCHANNELS; MULTIWALLED CARBON NANOTUBES (MWCN); SILICONES; SOLVENTS;

POLYMER MATRIX COMPOSITES;

EID: 78049527478     PISSN: 00086223     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.carbon.2010.08.048     Document Type: Article

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