Thermal assisted ultrasonic bonding of multilayer polymer microfluidic devices

Journal of Micromechanics and Microengineering

Volumn 20, Issue 1, 2010, Pages

  Zhang, Zongbo ^a   Luo, Yi ^a   Wang, Xiaodong ^a   Zheng, Yingsong ^a   Zhang, Yanguo ^a   Wang, Liding ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPLEX NETWORKS; ESTERS; ETHYLENE; FLUIDIC DEVICES; MICROFLUIDICS; MULTILAYERS; POLYETHYLENE TEREPHTHALATES; POLYMERS; TENSILE STRENGTH; ULTRASONIC APPLICATIONS; ULTRASONIC EFFECTS;

CYCLO-OLEFIN POLYMERS; MICRO-FLUIDIC DEVICES; POLY(ETHYLENE TEREPHTHALATE) (PET); POLY(METHYL METHACRYLATE) (PMMA); POLYMER MICROFLUIDIC DEVICES; POTENTIAL METHODS; ULTRASONIC BONDING; ULTRASONIC VIBRATION;

GLASS TRANSITION;

EID: 78049459325     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/1/015036     Document Type: Article

References (15)

1. Han M, Lee W, Lee S K and Lee S S 2004 3D microfabrication with inclined/rotated UV lithography Sensors Actuators A 111 14-20.
2. Yu H, Li B and Zhang X 2006 Flexible fabrication of three-dimensional multi-layered microstructures using a scanning laser system Sensors Actuators A 125 553-64.
3. Ziaie B, Baldia A, Lei M, Gu Y and Siege R 2004 Hard and soft micromachining for BioMEMS: review of techniques and examples of applications in microfluidics and drug delivery Adv. Drug Deliv. Rev. 56 145-72.
4. Fuentest H V and Woolley A T 2008 Phase-changing sacrificial layer fabrication of multilater polymer microfluidic devices Anal. Chem. 80 333-39.
5. Eddings M A, Johnson M A and Gale B K 2008 Determining the optimal PDMS-PDMS bonding technique for microfluidic devices J. Micromech. Microeng. 18 26-30.
6. Lai J, Yuan H, Yi X and Liu S 2005 Laser bonding of multilayer polymer microfluidic chips Proc. SPIE 5628 56-62.
7. Truckenmueller R and Ahrens R 2006 An ultrasonic welding based process for building up a new class of inert fluidic micro sensors and actuators from polymers Sensors Actuators A 132 385-92.
8. Ng S H, Wang Z F and de Rooij N F 2009 Microfluidic connectors by ultrasonic welding Microelectron. Eng. 86 1354-7.
9. Kim J, Jeong B, Chiao M and Lin L 2009 Ultrasonic bonding for MEMS sealing and packaging IEEE Trans. Adv. Packag. 32 461-7.
10. Tolunay M N, Dawson P R and Wang K K 1983 Heating and bonding mechanisms in ultrasonic welding of thermoplastics Polym. Eng. Sci. 23 726-33.
11. Ng S H, Tjeung R T, Wang Z F, Lu A C W, Rodriguez I and de Rooij N F 2008 Thermally activated solvent bonding of polymers Microsyst. Technol. 14 753-75.
12. Li J M, Liu C, Qiao H C, Zhu L Y, Chen G and Dai X D 2008 Hot embossing/bonding of a PET microfluidic chip J. Micromech. Microeng. 18 1-10.
13. Chen Z F, Gao Y H, Lin J M, Su R G and Xie Y 2004 Vacuum-assisted thermal bonding of plastic capillary electrophoresis microchip imprinted with stainless steel template J. Chromatogr. A 1038 239-45.
14. Kelly R T and Woolley T 2003 Thermal bonding of polymeric capillary electrophoresis microdevices in water Anal. Chem. 75 941-5.
15. Patrick A, Lee N L and Nam T N 2007 Fabrication of planar nanofluidic channels in a thermoplastic by hot-embossing and thermal bonding Lab. Chip 7 520-2.