Traffic-thermal mutual-coupling co-simulation platform for three-dimensional network-on-chip

Proceedings of 2010 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2010

Volumn , Issue , 2010, Pages 135-138

  Jheng, Kai Yuan ^a   Chao, Chih Hao ^a   Wang, Hao Yu ^a   Wu, An Yeu ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACCURACY LOSS; BALANCED TRAFFIC; COMMERCIAL TOOLS; COMMUNICATION INFRASTRUCTURE; COSIMULATION; DYNAMIC THERMAL MANAGEMENT; MUTUAL COUPLING; NETWORK ON CHIP; RESEARCH FIELDS; SIMULATION RESULT; TEMPERATURE ERROR; THERMAL PROFILES; THERMAL-AWARE DESIGN; THREE-DIMENSIONAL (3D); THREE-DIMENSIONAL NETWORKS;

DESIGN; RESEARCH; SERVERS; TEMPERATURE CONTROL; VLSI CIRCUITS;

THREE DIMENSIONAL;

EID: 78049367591     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/VDAT.2010.5496709     Document Type: Conference Paper

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