Investigation of the effect of composition on microhardness and determination of thermo-physical properties in the Zn-Cu alloys

Materials and Design

Volumn 32, Issue 2, 2011, Pages 900-906

  Kaya, H ^a   Cadirli E ^b   Ulgen A ^a  

^a ERCIYES UNIVERSITY   (Turkey)

^b NIGDE UNIVERSITY   (Turkey)

Author keywords

E. Electrical resistivity; E. Microhardness; F. Microstructure

Indexed keywords

BRIDGMAN; CU ALLOY; CU CONTENT; DIFFERENTIAL SCANNING CALORIMETERS; DIRECTIONAL SOLIDIFICATION; DIRECTIONALLY SOLIDIFIED; E. ELECTRICAL; E. MICROHARDNESS; ELECTRICAL CONDUCTIVITY; ELECTRICAL RESISTIVITY; ENTHALPY OF FUSION; F. MICROSTRUCTURE; FOUR-POINT PROBE TECHNIQUES; HEATING CURVES; HIGH PURITY ALLOYS; MICROHARDNESS TESTS; SOLID-TO-LIQUID PHASE; SOLIDIFICATION CONDITION; THERMO-PHYSICAL PROPERTY;

ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY; MICROHARDNESS; MICROSTRUCTURE; SOLIDIFICATION; ZINC;

COPPER ALLOYS;

EID: 77958455427     PISSN: 02641275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matdes.2010.06.049     Document Type: Article

References (32)

1. Cubberly W., Bakerjian R. Tool and Manufacturing Engineers Handbook. Desk ed., Dearborn, Mich.: Society of Manufacturing Engineers. 1989, p. c15:40-41.
2. Park H.S., Kimura T., Murakami T., Nagano Y., Nakata K., Ushio M. Microstructures and mechanical properties of friction stir welds of 60%Cu-40%Zn copper alloy. Mater Sci Eng 2004, 37A:160-169.
3. Andersson CG, Andrews RE. In: Proceedings of the 1st international symposium on friction stir welding, 14-16 June 1999, Thousand Oaks, CA: USA.
4. Andersson CG, Andrews RE, Dance BGI, Russel MJ, Olden EJ, Sanderson RM. In: Proceedings of the 2nd FSW symposium on comparison of copper canister fabrication by the electron beam and friction stir processes, 26-28 June 2000, Gothenburg: Sweden.
5. Bang KS, Lee WB, Yeon YM, Jung SB. In: International welding/joining conference-Korea, October 2002, Gyeongju: Korea; p. 2830.
6. Ravindranathan P., Patal K.C. Novel solid solution precursor method for the preparation of ultrafine Ni-Zn ferrites. Mater Sci 1987, 22:3261-3264.
7. Flores O.V., Kennedy C., Murr L.E., Brown D., Pappu S., Nowak B.M., et al. Microstructural issues in a friction-stir-welded aluminum alloy. Scripta Mater 1998, 38:703-708.
8. Hung F.Y., Lui T.S., Chen L.H., You J.G. Vibration fracture behavior of Sn-9Zn-x Cu lead-free solders. J Mater Sci 2007, 42:3865-3873.
9. David A., Porter K.E. Easterling, phase transformations in metals and alloys 1992, CRC Press, 185. 2nd ed.
10. Hunziker O., Vandyoussefi M., Kurz W. Phase and microstructure selection in peritectic alloys close to the limit of constitutional undercooling. Acta Mater 1998, 46(18):6325-6336.
11. Kerr H.W., Kurz W. Solidification of peritectic alloys. Int Mater Rev 1996, 41:129-164.
12. Su Y., Wang M., Lin X., Huang W. Researches on lamellar structures in the unidirectional solidified Zn-2 wt.%Cu peritectic alloy. Mater Lett 2004, 58:2670-2674.
13. Li Y., Ng S.C., Ma D., Jones H. Observation of lamellar eutectic-like structure in a Zn-rich Zn-3.37wt.%Cu peritectic alloy processed by Bridgman solidification. Scripta Mater 1998, 39:7-11.
14. Ma D., Xu W., Ng S.C., Li Y. On secondary dendrite arm coarsening in peritectic solidification. Mater Sci Eng A 2005, 390:52.
15. Ma D., Li Y., Ng S.C., Jones H. Unidirectional solidification of Zn-rich Zn-Cu peritectic alloys-1 microstructure selection. Acta Mater 2000, 48:419-431.
16. Kaya H., Çadi{dotless}rli{dotless} E., Böyük U., Maraşli{dotless} N. Variation of microindentation hardness with solidification and microstructure parameters in the Al based alloys. Appl Surf Sci 2008, 255:3071-3078.
17. Smiths F.M. Measurement of sheet resistivities with the four-point probe. Bell Syst Technol J 1958, 37:711-712.
18. Berkdemir A, Gündüz M, Kaya H. Ariation of Microhardness with the primary dendrite arm spacing, composition and growth rate for the directionally solidified pb-cd alloy, MS&T06 (Mater Sci Technol 2006), October 15-19 2006, Duke Energy Center Cincinnati, OHIO; p. 168.
19. Smedskjaer M.M., Jensen M., Yue Y. Effect of thermal history and chemical composition on hardness of silicate glasses. J Non-Cryst Solids 2010, 356:893-897.
20. Li J., Qu Z., Wu R., Zhang M. Effects of Cu addition on the microstructure and hardness of Mg-5Li-3Al-2Zn, Alloy. Mater Sci Eng 2010, A527:2780-2783.
21. x alloys. Physica B 2009, 404:3761-3765.
22. Pattanaik A.K., Robi P.S., Srinivasan A. Microhardness of Pb modified chalcogenide glasses. J Optoelect Adv Mater 2003, 5(1):35-38.
23. Vural ME. Investigation of relationships between the microhardness and the microstructure parameters, and the solidification parameters in metallic alloys, Ms. Thesis, Niĝde University; 2007; p. 72.
24. 5 glass system. Bull Mater Sci 2006, 29(1):43-48.
25. Xiang W., Mei L.H., Lin L.X., Feng Z.Y. Effect of cooling rate and composition on microstructures and, properties of Zn-Mg alloys. Trans Nonf Met Soc China 2007, 17:122-125.
26. Novinrooz A.J., Seyedi H., Larijani M.M. Microhardness study of Ti(C, N) films deposited on S-316 by the hallow cathode discharge gun. J.Achieve Mater Manufact Eng 2006, 14:59-63.
27. x, Jpn. J Appl Phys 2000, 39:5180-5183.
28. Hultgren R., Orr R.L., Anderson P.D., Kelley K.K. Selected values of thermodynamic properties of metals and alloys 1963, Wiley, University of California, Berkeley, [318-22].
29. El-Ashram T., Shalaby R.M. Effect of rapid solidification and small additions of Zn and Bi on the structure and properties of Sn-Cu eutectic alloy. J Electron Mater 2005, 34:212-215.
30. Saatci B., Ari{dotless} M., Gündüz M., Meydaneri F., Bozoklu M., Durmus S. Thermal and electrical conductivities of Cd-Zn alloys. J Phys Condens Mater 2006, 18:10643-10653.
31. Çadi{dotless}rli{dotless} E., Böyük U., Engin S., Kaya H., Maraşli{dotless} N. Variations of microhardness with the solidification processing parameters and thermo-electrical properties with the temperature in the Sn-Cu alloy. Kovove Mater 2009, 47:381-387.
32. Çadi{dotless}rli{dotless} E., Böyük U., Engin S., Kaya H., Maraşli{dotless} N., Ari{dotless} M. Investigation of microhardness and thermo-electrical properties in the Sn-Cu hypereutectic alloy. J Mater Sci: Mater Electron 2010, 21:468-474.