Vibration fracture behavior of Sn-9Zn-xCu lead-free solders

Journal of Materials Science

Volumn 42, Issue 11, 2007, Pages 3865-3873

  Hung, Fei Yi ^a   Lui, Truan Sheng ^a   Chen, Li Hui ^a   You, Ji Ge ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DAMPING; DEFORMATION; DENDRITES (METALLOGRAPHY); DETERIORATION; EUTECTICS; FRACTURE; INTERMETALLICS; MICROSTRUCTURE; TIN; VIBRATIONS (MECHANICAL);

LAMELLAR-DEFORMED STRUCTURES (LDS); PHASE DENDRITES; VIBRATION DEFORMATION; VIBRATION ENERGY; VIBRATION FRACTURE;

SOLDERING ALLOYS;

EID: 34249782596     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-006-0463-3     Document Type: Article

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