Variations of microhardness with the solidification processing parameters and thermo-electrical properties with the temperature in the Sn-Cu alloy

Kovove Materialy

Volumn 47, Issue 6, 2009, Pages 381-387

  Cadirh E ^a   Boyuk U ^b   Engin, S ^b   Kaya, H ^b   Marasli N ^b  

^a NIGDE UNIVERSITY   (Turkey)

^b ERCIYES UNIVERSITY   (Turkey)

Author keywords

Electrical resistivity conductivity; Eutectic solidification; Hardness; Soldering

Indexed keywords

EID: 75149167886     PISSN: 0023432X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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