Investigation of microhardness and thermo-electrical properties in the Sn-Cu hypereutectic alloy

Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 5, 2010, Pages 468-474

  Cadirli E ^a   Boyuk U ^b   Engin, S ^b   Kaya, H ^b   Marasli N ^b   Ari M ^b  

^a NIGDE UNIVERSITY   (Turkey)

^b ERCIYES UNIVERSITY   (Turkey)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY; EUTECTICS; GROWTH RATE; HVDC POWER TRANSMISSION; MICROHARDNESS; THERMAL CONDUCTIVITY; THERMAL GRADIENTS; TIN ALLOYS;

CONSTANT GROWTH RATES; CONSTANT TEMPERATURE; DIFFERENTIAL SCANNING CALORIMETERS; DIRECTIONALLY SOLIDIFIED; ELECTRICAL CONDUCTIVITY; FOUR-POINT PROBE TECHNIQUES; HYPEREUTECTIC ALLOY; MICROHARDNESS TESTS;

COPPER ALLOYS;

EID: 77953321466     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-009-9940-1     Document Type: Article

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