-
1
-
-
0004151449
-
-
Springer-Verlag, New York
-
R. Holm, Electric contacts, theory and application, 4 ed., Springer-Verlag, New York, 1967
-
(1967)
Electric Contacts, Theory and Application, 4 Ed.
-
-
Holm, R.1
-
2
-
-
33746561137
-
Characteristics & electric contact behavior of tarnished film covered on silver plated surface formed by indoor air exposure
-
Chicago, IL, USA, Sep 16-20
-
J. G. Zhang, X. Y. Lin, and K. Sugimura, "Characteristics & electric contact behavior of tarnished film covered on silver plated surface formed by indoor air exposure," Proceedings of the 1996 42nd IEEE Holm Conference on Electrical Contacts Joint with the 18th International Conference on Electrical Contacts, Chicago, IL, USA, Sep 16-20, 1996.
-
(1996)
Proceedings of the 1996 42nd IEEE Holm Conference on Electrical Contacts Joint with the 18th International Conference on Electrical Contacts
-
-
Zhang, J.G.1
Lin, X.Y.2
Sugimura, K.3
-
3
-
-
0033722290
-
Contact resistance changes of silver, silver alloys, and gold plated silver coupons exposed to ozone
-
N. R. Aukland, H. C. Hardee, S. Hessefort, and J. P. Miller, "Contact resistance changes of silver, silver alloys, and gold plated silver coupons exposed to ozone," IEEE Transactions on Components and Packaging Technologies, 23, pp. 317-322, 2000.
-
(2000)
IEEE Transactions on Components and Packaging Technologies
, vol.23
, pp. 317-322
-
-
Aukland, N.R.1
Hardee, H.C.2
Hessefort, S.3
Miller, J.P.4
-
4
-
-
0026852569
-
Significant increase of contact resistance of silver contacts by mechanical switching actions
-
M. Hasegawa, T. Yamamoto and K. Sawa, "Significant increase of contact resistance of silver contacts by mechanical switching actions," IEEE Transactions on Components, Hybrids and Manufacturing Technology, 15, pp. 177-183, 1992.
-
(1992)
IEEE Transactions on Components, Hybrids and Manufacturing Technology
, vol.15
, pp. 177-183
-
-
Hasegawa, M.1
Yamamoto, T.2
Sawa, K.3
-
5
-
-
0028385972
-
Contact resistance characteristics of Ag material in breaking low-load DC arcs
-
Z.-K. Chen, H. Mizukoshi and K. Sawa, "Contact resistance characteristics of Ag material in breaking low-load DC arcs," IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A, 17, pp.113-120, 1994.
-
(1994)
IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A
, vol.17
, pp. 113-120
-
-
Chen, Z.-K.1
Mizukoshi, H.2
Sawa, K.3
-
6
-
-
0028753229
-
Measurement on contact resistance and surface profile of arcing AG contacts
-
Chicago, IL, USA, Oct 17-19
-
H. Sone, H. Sugimoto, and T. Takagi, "Measurement on contact resistance and surface profile of arcing AG contacts," Proceedings of the 40th Holm Conference on Electrical Contacts, Chicago, IL, USA, Oct 17-19, 1994.
-
(1994)
Proceedings of the 40th Holm Conference on Electrical Contacts
-
-
Sone, H.1
Sugimoto, H.2
Takagi, T.3
-
7
-
-
0029322505
-
Effect of oxide films and arc duration characteristics on Ag contact resistance behavior
-
Z.-K. Chen, and K. Sawa, "Effect of oxide films and arc duration characteristics on Ag contact resistance behavior," IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A, 18, pp. 409-416, 1995.
-
(1995)
IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A
, vol.18
, pp. 409-416
-
-
Chen, Z.-K.1
Sawa, K.2
-
8
-
-
0034497653
-
Erosion and contact resistance performance of materials for sliding contacts under arcing
-
Chicago, IL, USA, Sep 25 - 27
-
N. B. Jemaa, L. Morin, D. Jeannot, and F. Hauner, "Erosion and contact resistance performance of materials for sliding contacts under arcing," Proceedings of the 46th IEEE Holm Conference on Electrical Contacts, Chicago, IL, USA, Sep 25 - 27, 2000.
-
(2000)
Proceedings of the 46th IEEE Holm Conference on Electrical Contacts
-
-
Jemaa, N.B.1
Morin, L.2
Jeannot, D.3
Hauner, F.4
-
9
-
-
10444241853
-
A micromechanics model for electrical conduction in isotropically conductive adhesives during curing
-
Las Vegas, NV, USA, Jun 1-4
-
B. Su, and J. Qu, "A Micromechanics Model for Electrical Conduction in Isotropically Conductive Adhesives during Curing", Proceedings of the 54th Electronic Components and Technology Conference, Las Vegas, NV, USA, Jun 1-4, 2004.
-
(2004)
Proceedings of the 54th Electronic Components and Technology Conference
-
-
Su, B.1
Qu, J.2
-
10
-
-
10444247342
-
Conductivity improvement of isotropic conductive adhesives with short-chain dicarboxylic acids
-
Las Vegas, NV, USA, Jun 1-4
-
Y. Li, K.-S. Moon, H. Li, and C. P. Wong, "Conductivity improvement of isotropic conductive adhesives with short-chain dicarboxylic acids," Proceedings of the 54th Electronic Components and Technology Conference, Las Vegas, NV, USA, Jun 1-4, 2004
-
(2004)
Proceedings of the 54th Electronic Components and Technology Conference
-
-
Li, Y.1
Moon, K.-S.2
Li, H.3
Wong, C.P.4
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