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Volumn 2005, Issue , 2005, Pages 75-78

Electrical contact resistance of silver with different coatings

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT LOADS; CONTACT PRESSURE; HERTZIAN SOLUTION; SILVER RODS;

EID: 33746478555     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432050     Document Type: Conference Paper
Times cited : (3)

References (10)
  • 9
    • 10444241853 scopus 로고    scopus 로고
    • A micromechanics model for electrical conduction in isotropically conductive adhesives during curing
    • Las Vegas, NV, USA, Jun 1-4
    • B. Su, and J. Qu, "A Micromechanics Model for Electrical Conduction in Isotropically Conductive Adhesives during Curing", Proceedings of the 54th Electronic Components and Technology Conference, Las Vegas, NV, USA, Jun 1-4, 2004.
    • (2004) Proceedings of the 54th Electronic Components and Technology Conference
    • Su, B.1    Qu, J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.