SCOPUS 정보 검색 플랫폼

Volumn 37, Issue 6, 2008, Pages 845-851

Decapsulation method for flip chips with ceramics in microelectronic packaging

Author keywords

Ceramic substrate; Decapsulation method; Flip chip; Lead free; Microelectronic packaging

Indexed keywords

CERAMIC SUBSTRATES; DECAPSULATION METHOD; MECHANICAL STRESS;

CERAMIC MATERIALS; COMPUTATIONAL METHODS; ELECTRONICS PACKAGING; FAILURE ANALYSIS; MICROELECTRONICS; MICROPROCESSOR CHIPS; SURFACE PROPERTIES;

FLIP CHIP DEVICES;

EID: 42449160888 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0387-6 Document Type: Article

Times cited : (7)

References (13)

1
- 36449008212
- M. McCormack, S. Jin, G.W. Kammlott and H.S.Chen, Appl. Phys. Lett. 63, 15 (1993).
- (1993) Appl. Phys. Lett. , vol.63 , pp. 15
- McCormack, M.¹ Jin, S.² Kammlott, G.W.³ Chen, H.S.⁴

2
- 0000336248
- L.F. Miller, IBM J. Res. Develop. 13, 239 (1969).
- (1969) IBM J. Res. Develop. , vol.13 , pp. 239
- Miller, L.F.¹

3
- 4344704701
- J.H.L. Pang, T.H. Low, B.S. Xiong, L.H. Xu and C.C. Neo, Thin Solid Films, 462-463, 370 (2004).
- (2004) Thin Solid Films , vol.462-463 , pp. 370
- Pang, J.H.L.¹ Low, T.H.² Xiong, B.S.³ Xu, L.H.⁴ Neo, C.C.⁵

4
- 84954065778
- Singapore
- J.H.L. Pang, T.H. Low, B.S. Xiong, and F.X. Che, Proceedings of IEEE, 2003 Electronics Packaging Technology Conference (Singapore, 2003), pp. 470-478.
- (2003) Proceedings of IEEE, 2003 Electronics Packaging Technology Conference , pp. 470-478
- Pang, J.H.L.¹ Low, T.H.² Xiong, B.S.³ Che, F.X.⁴

5
- 0035501302
- F.A. Stam and E. Davitt, Microelectronics Reliability, 41, p1815 (2001).
- (2001) Microelectron. Reliab. , vol.41 , pp. 1815
- Stam, F.A.¹ Davitt, E.²

6
- 84904078641
- B. Ma, Q.K. Tong, and A. Savoca, Electronic Components and Technology Conference, Proceedings. 50th. P252-5 (1998).
- (1998) Electronic Components and Technology Conference, Proceedings. 50th. P252-5
- Ma, B.¹ Tong, Q.K.² Savoca, A.³

7
- 0029218671
- Las Vegas, NA
- D. Suryanarayana, J.A. Varcoe, and J.V. Ellerson, Proceedings of 45th Electronic Components & Technology Conference (Las Vegas, NA, 1995), pp. 524-528.
- (1995) Proceedings of 45th Electronic Components & Technology Conference , pp. 524-528
- Suryanarayana, D.¹ Varcoe, J.A.² Ellerson, J.V.³

8
- 42449096526
- U.S. patent 52,74913 (January)
- K.R. Grebe, J.M. McCeary, D. Suryanarayana, and H.M. Tong, U.S. patent 52,74913 (January 1994).
- (1994)
- Grebe, K.R.¹ McCeary, J.M.² Suryanarayana, D.³ Tong, H.M.⁴

9
- 42449136365
- San Jose, CA, Febuary
- T. Gregorich, H. Hoang and S. Mok, First Symposium on Flip Chip Technology (San Jose, CA, Febuary 1994).
- (1994) First Symposium on Flip Chip Technology
- Gregorich, T.¹ Hoang, H.² Mok, S.³

10
- 42449104528
- S.V. Vasan, P.T. Truong and G. Gody, Circuit World, 21(3), 16 (1995).
- (1995) Circuit World , vol.21 , pp. 16
- Vasan, S.V.¹ Truong, P.T.² Gody, G.³

11
- 0027321941
- Orlando, FL
- Y. Tsukada, S. Tsuchida, and Y. Mashimoto, Proceedings of 43rd Electronic Components & Technology Conference (Orlando, FL, 1993), pp. 199-204.
- (1993) Proceedings of 43rd Electronic Components & Technology Conference , pp. 199-204
- Tsukada, Y.¹ Tsuchida, S.² Mashimoto, Y.³

12
- 42449113506
- Hawaii
- F.L. Pompeo, A.J. Call, J.T. Coffin, and S. Buchwalter, Interpak 95 (Hawaii, 1995).
- (1995) Interpak 95
- Pompeo, F.L.¹ Call, A.J.² Coffin, J.T.³ Buchwalter, S.⁴

13
- 42449119047
- U.S. patent 5371328 (6 December)
- B.L. Gutierrez and C.Y. Yu, U.S. patent 5371328 (6 December 1994).
- (1994)
- Gutierrez, B.L.¹ Yu, C.Y.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.