-
1
-
-
0002392110
-
-
Chapman & Hall: New York, Chapter 1
-
Tummala, R. R.; Rymaszewski, E. J.; Klopfenstein, A. Microelectronics Packaging Handbook; Chapman & Hall: New York, 1997; Vol. 1, Chapter 1, pp 76-78.
-
(1997)
Microelectronics Packaging Handbook
, vol.1
, pp. 76-78
-
-
Tummala, R.R.1
Rymaszewski, E.J.2
Klopfenstein, A.3
-
3
-
-
0004673953
-
-
Van Nostrand Reinhold: New York, Chapter 12
-
Lau, J. H. Chip on Board. Van Nostrand Reinhold: New York, 1994; Chapter 12, pp 504-528.
-
(1994)
Chip on Board
, pp. 504-528
-
-
Lau, J.H.1
-
5
-
-
0343872288
-
-
U.S. Patent 5,560,934, Oct 1, 1996
-
Afzali-Ardakani, A.; Buchwalter, S. L.; Gelorme, J. D.; Kosbar, L. L.; Newman, B. H.; Pompe, F. L. U.S. Patent 5,560,934, Oct 1, 1996.
-
-
-
Afzali-Ardakani, A.1
Buchwalter, S.L.2
Gelorme, J.D.3
Kosbar, L.L.4
Newman, B.H.5
Pompe, F.L.6
-
6
-
-
0343436498
-
-
Feb. Atlanta, GA
-
Buchwalter, S. L.; Call, A. J.; Coffin, J. T.; Pompeo, F. L. Proc. 1st International Symposium on Advanced Packaging Materials, Process, Properties, and Interfaces, Feb. 1995, Atlanta, GA; p 7.
-
(1995)
Proc. 1st International Symposium on Advanced Packaging Materials, Process, Properties, and Interfaces
, pp. 7
-
-
Buchwalter, S.L.1
Call, A.J.2
Coffin, J.T.3
Pompeo, F.L.4
-
7
-
-
0029218671
-
-
May Las Vegas, NV
-
Suryanarayana, D.; Varcoe, J. A.; Ellerson, J. V. Proc. 45th Electronic Components and Technology Conference, May 1995, Las Vegas, NV; pp 524-528.
-
(1995)
Proc. 45th Electronic Components and Technology Conference
, pp. 524-528
-
-
Suryanarayana, D.1
Varcoe, J.A.2
Ellerson, J.V.3
-
8
-
-
0000498052
-
-
Yang, S.; Chen, J.; Korner, H.; Breiner, T.; Ober, C. K.; Poliks, M. Chem Mater 1998, 10, 1475-1482.
-
(1998)
Chem Mater
, vol.10
, pp. 1475-1482
-
-
Yang, S.1
Chen, J.2
Korner, H.3
Breiner, T.4
Ober, C.K.5
Poliks, M.6
-
9
-
-
0031234917
-
-
Yang, S.; Chen, J.; Korner, H.; Breiner, T.; Ober, C. K. Polym Prepr papers presented at the Meeting, ACS Division of Polymer Chemistry 1997, 38, 440-441.
-
(1997)
Meeting, ACS Division of Polymer Chemistry
, vol.38
, pp. 440-441
-
-
Yang, S.1
Chen, J.2
Korner, H.3
Breiner, T.4
Ober, C.K.5
-
10
-
-
0031369754
-
-
October Norkoping, Sweden
-
Nguyen, L.; Hoang, L.; Fine, P.; Shi, S.; Vincent, M. B.; Wang, L.; Wong, C. P.; Tong, Q.; Ma, B.; Humphreys, R.; Savoca, A. Proc. 1st IEEE International Symposium on Polymeric Electronic Packaging, October 1997, Norkoping, Sweden; pp 300-306.
-
(1997)
Proc. 1st IEEE International Symposium on Polymeric Electronic Packaging
, pp. 300-306
-
-
Nguyen, L.1
Hoang, L.2
Fine, P.3
Shi, S.4
Vincent, M.B.5
Wang, L.6
Wong, C.P.7
Tong, Q.8
Ma, B.9
Humphreys, R.10
Savoca, A.11
-
12
-
-
0031633709
-
-
May Seattle, WA
-
Vincent, M. B.; Meyers, L.; Wong, C. P. Proc. 48th Electronic Components and Technology Conference, May 1998, Seattle, WA; pp 125-131.
-
(1998)
Proc. 48th Electronic Components and Technology Conference
, pp. 125-131
-
-
Vincent, M.B.1
Meyers, L.2
Wong, C.P.3
-
15
-
-
0004366550
-
-
Rivero, I. A.; Somanathan, R.; Hellberg, L. H. Org Prep Proc Int 1992, 24, 363-365.
-
(1992)
Org Prep Proc Int
, vol.24
, pp. 363-365
-
-
Rivero, I.A.1
Somanathan, R.2
Hellberg, L.H.3
-
17
-
-
0007488933
-
-
Choppin, A. R.; Rogers, J. W. J Am Chem Soc 1948, 70, 1948, 2967.
-
(1948)
J Am Chem Soc
, vol.70
, Issue.1948
, pp. 2967
-
-
Choppin, A.R.1
Rogers, J.W.2
-
18
-
-
0007528788
-
-
Matzner, M.; Kurkjy, R. P.; Cotter, R. J. Chem Rev 1965, 65, 645-687.
-
(1965)
Chem Rev
, vol.65
, pp. 645-687
-
-
Matzner, M.1
Kurkjy, R.P.2
Cotter, R.J.3
-
19
-
-
0343179498
-
-
Jellinek, H. H. G., Ed.; Elsevier: New York
-
Schneider, H. A. In Degradation and Stabilization of Polymers; Jellinek, H. H. G., Ed.; Elsevier: New York, 1983; Vol. 1, p 506.
-
(1983)
Degradation and Stabilization of Polymers
, vol.1
, pp. 506
-
-
Schneider, H.A.1
|