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Volumn 47, Issue 4, 2009, Pages 1073-1084

Thermally degradable maleimides for reworkable adhesives

Author keywords

Acetal ester; Adhesive; Degradable; Maleimide; Rework; Underfill

Indexed keywords

ACETAL ESTER; DEGRADABLE; MALEIMIDE; REWORK; UNDERFILL;

EID: 60649091796     PISSN: 0887624X     EISSN: 10990518     Source Type: Journal    
DOI: 10.1002/pola.23217     Document Type: Article
Times cited : (30)

References (35)
  • 2
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    • Woods, J. G, Morrill, S. D, Henkel Corporation, U.S. Patent 6,916,890, July 12, 2005
    • Woods, J. G.; Morrill, S. D. (Henkel Corporation). U.S. Patent 6,916,890, July 12, 2005.
  • 3
    • 60649092264 scopus 로고    scopus 로고
    • Woods, J. G, Torres-Filho, A, Yaeger, E. K, Wang, J, Henkel Corporation, U.S. Patent 6,887,737, May 3, 2005
    • Woods, J. G.; Torres-Filho, A.; Yaeger, E. K.; Wang, J. (Henkel Corporation). U.S. Patent 6,887,737, May 3, 2005.
  • 11
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    • Loy, D. A, Wheeler, D. R, Russick, E. M, McElhannon, J. R, Saunders, R. S, Sandia Corporation, U.S. Patent 6,337,384, January 8, 2002
    • Loy, D. A.; Wheeler, D. R.; Russick, E. M.; McElhannon, J. R.; Saunders, R. S. (Sandia Corporation). U.S. Patent 6,337,384, January 8, 2002.
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    • Jain, R.; Stanley, S. M.; Fréchet, J. M. J. Macromolecules 2007, 40, 452-457.
    • Jain, R.; Stanley, S. M.; Fréchet, J. M. J. Macromolecules 2007, 40, 452-457.
  • 25
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    • The polymerization of compound 2 was not conducted because its high viscosity made the mixing process difficult
    • The polymerization of compound 2 was not conducted because its high viscosity made the mixing process difficult.
  • 26
    • 60649099113 scopus 로고    scopus 로고
    • Compound 6 was synthesized according to the procedure: Musa, O, National Starch and Chemical Company, U.S. Patent 6,803,406, October 12, 2004
    • Compound 6 was synthesized according to the procedure: Musa, O. (National Starch and Chemical Company). U.S. Patent 6,803,406, October 12, 2004.
  • 27
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    • The die shear tests were conducted at 150°C because the upper temperature limit for the die shear testing equipment is 150°C. Exposure to 250°C for 2 min prior to the die shear measurements is to simulate the rework condition.
    • The die shear tests were conducted at 150°C because the upper temperature limit for the die shear testing equipment is 150°C. Exposure to 250°C for 2 min prior to the die shear measurements is to simulate the rework condition.
  • 29
    • 60649086116 scopus 로고    scopus 로고
    • DISCOVER computer program, Accelrys, San Diego, CA
    • DISCOVER computer program, Accelrys, San Diego, CA.
  • 32
    • 60649099325 scopus 로고    scopus 로고
    • Gordon, M. S; Schmidt, M. W. In Theory and Applications of Computational Chemistry: The First Forty Years; Dykstra, C. E.; Frenking, G.; Kim, K. S.; Scuseria, G. E., Eds.; Elsevier: Amsterdam, 2005.
    • (b) Gordon, M. S; Schmidt, M. W. In Theory and Applications of Computational Chemistry: The First Forty Years; Dykstra, C. E.; Frenking, G.; Kim, K. S.; Scuseria, G. E., Eds.; Elsevier: Amsterdam, 2005.
  • 34
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    • The significance of the reaction medium on reaction rate has been reported: Thames, S
    • The significance of the reaction medium on reaction rate has been reported: Thames, S. J Coat Technol 1990, 62, 51-56.
    • (1990) J Coat Technol , vol.62 , pp. 51-56
  • 35
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    • The cured sample was prepared by heating a mixture of 98 wt % compound 1 and 2 wt % USP-90MD at 120°C for 10 min.
    • The cured sample was prepared by heating a mixture of 98 wt % compound 1 and 2 wt % USP-90MD at 120°C for 10 min.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.