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Volumn 49, Issue 11, 2010, Pages 2177-2190

Parametric study on the combined thermal and hydraulic performance of single phase micro pin-fin heat sinks part I: Square and circle geometries

Author keywords

Electronic cooling; Heat sink; Micro heat transfer; Micro pin fin; Microchannel

Indexed keywords

AXIAL PITCH; COMPUTATIONAL FLUID DYNAMICS SOFTWARE; COVENTORWARE; ELECTRONIC COOLING; FIGURE OF MERIT; HIGH REYNOLDS NUMBER; HYDRAULIC DIAMETER; HYDRAULIC PERFORMANCE; LIQUID FLOW; LIQUID FLOW RATES; LOW REYNOLDS NUMBER; MICRO HEAT SINK; MICRO HEAT TRANSFER; PARAMETRIC STUDY; PIN FIN HEAT SINKS; PIN-FINS; SINGLE PHASE; SINGLE PHASE LIQUID FLOW; STRUCTURE CONSTANTS; THERMAL RESISTANCE; TRANSVERSE DIRECTIONS; UNIFORM HEAT FLUX;

EID: 77956611919     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2010.06.011     Document Type: Article
Times cited : (100)

References (12)
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    • DOI 10.1115/1.1772415
    • D. Kim, S.J. Kim, and A. Ortega Compact modeling of fluid flow and heat transfer in pin fin heat sinks Journal of Electronic Packaging, Transactions of the ASME 126 3 2004 342 350 (Pubitemid 40122700)
    • (2004) Journal of Electronic Packaging, Transactions of the ASME , vol.126 , Issue.3 , pp. 342-350
    • Kim, D.1    Kim, S.J.2    Ortega, A.3
  • 3
    • 38749126766 scopus 로고    scopus 로고
    • Experimental study of pressure drop and heat transfer in a single-phase micropin-fin heat sink
    • A. Siu-Ho, W. Qu, and F. Pfefferkorn Experimental study of pressure drop and heat transfer in a single-phase micropin-fin heat sink Journal of Electronic Packaging, Transactions of the ASME 129 4 2007 479 487
    • (2007) Journal of Electronic Packaging, Transactions of the ASME , vol.129 , Issue.4 , pp. 479-487
    • Siu-Ho, A.1    Qu, W.2    Pfefferkorn, F.3
  • 5
    • 33947108414 scopus 로고    scopus 로고
    • Pressure drop and heat transfer of square pin-fin arrays in in-line and staggered arrangements
    • T.-M. Jeng, and S.-C. Tzeng Pressure drop and heat transfer of square pin-fin arrays in in-line and staggered arrangements International Journal of Heat and Mass Transfer 50 2006 2364 2375
    • (2006) International Journal of Heat and Mass Transfer , vol.50 , pp. 2364-2375
    • Jeng, T.-M.1    Tzeng, S.-C.2
  • 7
    • 9744224394 scopus 로고    scopus 로고
    • Numerical shape optimization for high performance of a heat sink with pin-fins
    • K. Park, D.-H. Choi, and K.-S. Lee Numerical shape optimization for high performance of a heat sink with pin-fins Numerical Heat Transfer; Part A: Applications 46 9 2004 909 927
    • (2004) Numerical Heat Transfer; Part A: Applications , vol.46 , Issue.9 , pp. 909-927
    • Park, K.1    Choi, D.-H.2    Lee, K.-S.3
  • 8
    • 36849086364 scopus 로고    scopus 로고
    • TCPT-2006-096.R2: Micro scale pin fin heat sinks - Parametric performance evaluation study
    • Y. Peles, and A. Kosar TCPT-2006-096.R2: micro scale pin fin heat sinks - Parametric performance evaluation study IEEE Transactions on Components and Packaging Technologies 30 4 2007 855 865
    • (2007) IEEE Transactions on Components and Packaging Technologies , vol.30 , Issue.4 , pp. 855-865
    • Peles, Y.1    Kosar, A.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.