Experimental study of pressure drop and heat transfer in a single-phase micropin-fin heat sink

Journal of Electronic Packaging

Volumn 129, Issue 4, 2007, Pages 479-487

  Siu Ho, Abel ^a   Qu, Weilin ^a   Pfefferkorn, Frank ^b  

^a University of Hawaii at Manoa   (United States)

^b University of Wisconsin Madison   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; FRICTION; PRESSURE DROP; PRESSURE MEASUREMENT; REYNOLDS NUMBER; TEMPERATURE DISTRIBUTION;

COOLING LIQUIDS; FRICTION FACTORS; SINGLE PHASE MICROPIN FIN HEAT SINKS;

HEAT SINKS;

EID: 38749126766     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2804099     Document Type: Article

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