Design and optimization of pin fin heat sinks for low velocity applications

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 4, 1996, Pages 486-494

  Shaukatullah, H ^a   Storr, Wayne R ^a   Hansen, Bernt J ^a   Gaynes, Michael A ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

Design optimization; Electronic cooling; Low velocity; Pin fin heat sink; Thermal performance; Unshrouded flow

Indexed keywords

ALUMINUM; COOLING; COST EFFECTIVENESS; ELECTRONICS PACKAGING; HEAT FLUX; HEAT TRANSFER; OPTIMIZATION; SURFACE TREATMENT; THERMAL EFFECTS;

PIN FIN HEAT SINKS (PFHS);

FINS (HEAT EXCHANGE);

EID: 0030414113     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.554929     Document Type: Article

References (10)

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