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Volumn , Issue , 2010, Pages

Micro channel heat sink with embedded pin-fin structures

Author keywords

[No Author keywords available]

Indexed keywords

FIN HEAT SINKS; MICRO CHANNEL HEAT SINKS; PIN-FINS;

EID: 78649565642     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (5)

References (8)
  • 2
    • 9744224394 scopus 로고    scopus 로고
    • Numerical shape optimization for high performance of a heat sink with pin-fins
    • Park K., Choi, D.-H. and Lee, K.-S., "Numerical shape optimization for high performance of a heat sink with pin-fins," Numerical Heat Transfer; Part A: Applications, Vol. 46, No. 9, 2004, pp. 909-927.
    • (2004) Numerical Heat Transfer; Part A: Applications , vol.46 , Issue.9 , pp. 909-927
    • Park, K.1    Choi, D.-H.2    Lee, K.-S.3
  • 4
    • 0036641579 scopus 로고    scopus 로고
    • Analysis of three-dimensional heat transfer in micro-channel heat sinks
    • DOI 10.1016/S0017-9310(02)00101-1, PII S0017931002001011
    • Qu, W., Issam, M., "Analysis of three-dimensional heat transfer in micro-channel heat sinks," International Journal of Heat and Mass Transfer, Vol. 45, No. 19, 2002, pp. 3973-3985. (Pubitemid 34792334)
    • (2002) International Journal of Heat and Mass Transfer , vol.45 , Issue.19 , pp. 3973-3985
    • Qu, W.1    Mudawar, I.2
  • 5
    • 36849086364 scopus 로고    scopus 로고
    • TCPT-2006096.R2: Micro scale pin fin heat smks - Parametric performance evaluation study
    • Kosar, A., and Peles, Y., "TCPT-2006096.R2: Micro scale pin fin heat smks - Parametric performance evaluation study," IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 4, 2007, pp. 855-865.
    • (2007) IEEE Transactions on Components and Packaging Technologies , vol.30 , Issue.4 , pp. 855-865
    • Kosar, A.1    Peles, Y.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.