-
1
-
-
29544446940
-
Design optimization for pin-fin heat sinks
-
Chen, H.-T., Chen, P.-L, Horng, J.-T., and Hung, Y-H., "Design optimization for pin-fin heat sinks," Journal of Electronic Packaging, Transactions of the ASME, Vol. 127, No. 4, 2005, pp. 397-406.
-
(2005)
Journal of Electronic Packaging, Transactions of the ASME
, vol.127
, Issue.4
, pp. 397-406
-
-
Chen, H.-T.1
Chen, P.-L.2
Horng, J.-T.3
Hung, Y.-H.4
-
2
-
-
9744224394
-
Numerical shape optimization for high performance of a heat sink with pin-fins
-
Park K., Choi, D.-H. and Lee, K.-S., "Numerical shape optimization for high performance of a heat sink with pin-fins," Numerical Heat Transfer; Part A: Applications, Vol. 46, No. 9, 2004, pp. 909-927.
-
(2004)
Numerical Heat Transfer; Part A: Applications
, vol.46
, Issue.9
, pp. 909-927
-
-
Park, K.1
Choi, D.-H.2
Lee, K.-S.3
-
4
-
-
0036641579
-
Analysis of three-dimensional heat transfer in micro-channel heat sinks
-
DOI 10.1016/S0017-9310(02)00101-1, PII S0017931002001011
-
Qu, W., Issam, M., "Analysis of three-dimensional heat transfer in micro-channel heat sinks," International Journal of Heat and Mass Transfer, Vol. 45, No. 19, 2002, pp. 3973-3985. (Pubitemid 34792334)
-
(2002)
International Journal of Heat and Mass Transfer
, vol.45
, Issue.19
, pp. 3973-3985
-
-
Qu, W.1
Mudawar, I.2
-
5
-
-
36849086364
-
TCPT-2006096.R2: Micro scale pin fin heat smks - Parametric performance evaluation study
-
Kosar, A., and Peles, Y., "TCPT-2006096.R2: Micro scale pin fin heat smks - Parametric performance evaluation study," IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 4, 2007, pp. 855-865.
-
(2007)
IEEE Transactions on Components and Packaging Technologies
, vol.30
, Issue.4
, pp. 855-865
-
-
Kosar, A.1
Peles, Y.2
-
6
-
-
20544439356
-
Forced convective heat transfer across a pin fin micro heat sink
-
Peles, Y., Kosar, A., Mishra, C., Kuo, C.-J., and Schneidern, B., "Forced convective heat transfer across a pin fin micro heat sink," Journal of Electronic Packaging, Transactions of the ASME International Journal of Heat and Mass Transfer, Vol. 48, No. 17, 2005, pp. 3615-3627.
-
(2005)
Journal of Electronic Packaging, Transactions of the ASME International Journal of Heat and Mass Transfer
, vol.48
, Issue.17
, pp. 3615-3627
-
-
Peles, Y.1
Kosar, A.2
Mishra, C.3
Kuo, C.-J.4
Schneidern, B.5
-
7
-
-
85196974928
-
Characteristic study on the optimization of pin-fin micro heat sink
-
Lake Buena Vista, FL
-
John, T. J., Mathew, B., and Hegab, H., "Characteristic Study on the Optimization of Pin-Fin Micro Heat Sink," 2009 AMSE International Mechanical Engineering Congress and Exposition, Lake Buena Vista, FL, 2009.
-
(2009)
2009 AMSE International Mechanical Engineering Congress and Exposition
-
-
John, T.J.1
Mathew, B.2
Hegab, H.3
-
8
-
-
0033351888
-
Heat transfer in 3-D serpentine channels with right-angle turns
-
Chintada, S., Ko, K.-H. and Anand, N. K., "Heat transfer in 3-D serpentine channels with right-angle turns," Numerical Heat Transfer; Part A: Applications, vol. 36, no. 8, 1999, pp. 781-806.
-
(1999)
Numerical Heat Transfer; Part A: Applications
, vol.36
, Issue.8
, pp. 781-806
-
-
Chintada, S.1
Ko, K.-H.2
Anand, N.K.3
|