Design optimization for pin-fin heat sinks

Journal of Electronic Packaging

Volumn 127, Issue 4, 2005, Pages 397-406

  Chen, Han Ting ^a   Chen, Po Li ^a   Horng, Jenn Tsong ^a   Hung, Ying Huei ^a,b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b ASMS   (Taiwan)

Author keywords

CCD; DOE; Mass constraint; Optimal thermal design; Pin fin heat sink; Pressure loss; RSM; Thermal resistance

Indexed keywords

COMPUTER SIMULATION; HEAT RESISTANCE; HYDRODYNAMICS; MATHEMATICAL MODELS; OPTIMIZATION; PRESSURE DROP; REGRESSION ANALYSIS;

DOE; MASS CONSTRAINTS; OPTIMAL THERMAL DESIGN; PIN-FIN HEAT SINKS;

HEAT SINKS;

EID: 29544446940     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2056572     Document Type: Article

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