Investigation of the effects of process parameters on the glass-to-mold sticking force during precision glass molding

Surface and Coatings Technology

Volumn 205, Issue 2, 2010, Pages 312-319

  Fischbach, Kyle D ^a   Georgiadis, Kyriakos ^b   Wang, Fei ^b   Dambon, O ^b   Klocke, F ^b   Chen, Yang ^a   Yi, Allen Y ^a  

^a Ohio State University   (United States)

^b FRAUNHOFER INSTITUTE FOR PRODUCTION TECHNOLOGY IPT   (Germany)

Author keywords

Precision glass molding; Sticking force; Thin film coating

Indexed keywords

ADHESION PROBLEM; CEMENTED CARBIDES; COMPRESSION FORCE; COOLING TIME; ENGINEERING MATERIALS; FORMING CONDITIONS; GLASS MOLDING; GLASS MOLDS; HIGH HARDNESS; HIGH PRECISION; HOLD TIME; INERT MATERIALS; LOW COSTS; MANUFACTURING PROCESS; MOLD FABRICATION; MOLD SURFACES; MOLDING PROCESS; OPTICAL ELEMENTS; PRECISION GLASS; PROCESS PARAMETERS; SILICON SUBSTRATES; SILICON WAFER SUBSTRATES; STICKING FORCE; THIN COATING; THIN FILM COATING; THIN-FILM COATINGS; WHITE-LIGHT INTERFEROMETRY; WORK PIECES;

COATINGS; COMPRESSION MOLDING; DESIGN OF EXPERIMENTS; GLASS; HEAT RESISTANCE; IRIDIUM; MOLDS; PLATINUM; PROCESS ENGINEERING; RESEARCH; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SUBSTRATES; THIN FILMS; TUNGSTEN; VAPOR DEPOSITION;

TUNGSTEN CARBIDE;

EID: 77956444354     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2010.06.049     Document Type: Article

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