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Volumn 7, Issue 2, 2001, Pages 123-131

Effects of electroplated Cu thickness and polyimide plasma treatment conditions on the interfacial fracture mechanics parameters in the Cu/Cr/polyimide system

Author keywords

Cu film; Interfacial fracture energy; Peel test; Phase angle; Polyimide

Indexed keywords

FILM THICKNESS; FRACTURE ENERGY; METALLIC FILMS; PLASMA APPLICATIONS;

EID: 0039842082     PISSN: 12259438     EISSN: None     Source Type: Journal    
DOI: 10.1007/bf03026950     Document Type: Article
Times cited : (12)

References (24)
  • 14
    • 0039561144 scopus 로고    scopus 로고
    • Ph. D. Thesis, KAIST
    • Y. B. Park, Ph. D. Thesis, KAIST (1999).
    • (1999)
    • Park, Y.B.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.