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Volumn 7, Issue 2, 2001, Pages 123-131
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Effects of electroplated Cu thickness and polyimide plasma treatment conditions on the interfacial fracture mechanics parameters in the Cu/Cr/polyimide system
a b |
Author keywords
Cu film; Interfacial fracture energy; Peel test; Phase angle; Polyimide
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Indexed keywords
FILM THICKNESS;
FRACTURE ENERGY;
METALLIC FILMS;
PLASMA APPLICATIONS;
CU FILMS;
ELASTO-PLASTIC FINITE ELEMENT ANALYSIS;
FOUNDATION MODELING;
INTERFACIAL FRACTURE ENERGY;
INTERFACIAL FRACTURE MECHANICS;
PEEL TESTS;
PHASE ANGLES;
THEORETICAL METHODS;
POLYIMIDES;
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EID: 0039842082
PISSN: 12259438
EISSN: None
Source Type: Journal
DOI: 10.1007/bf03026950 Document Type: Article |
Times cited : (12)
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References (24)
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