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Volumn 7, Issue 7-8, 2010, Pages 2010-2012
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Gate-recessed normally-off GaN-on-Si HEMT using a new O2- BCl3 digital etching technique
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Author keywords
AlGaN GaN; Electrical properties; High mobility transistors; Plasma etching
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Indexed keywords
ALGAN/GAN;
ALGAN/GAN HEMTS;
ATOMIC LAYER ETCHING;
BORON TRICHLORIDE;
BREAKDOWN VOLTAGE;
DEPLETION MODES;
DEVICE LAYOUT;
DRAIN LEAKAGE CURRENT;
ELECTRICAL PROPERTY;
ENHANCEMENT MODES;
ETCH PROCESS;
ETCH RATES;
ETCHING TECHNIQUE;
GATE RECESS;
HIGH MOBILITY;
HIGH VOLTAGE DEVICES;
PROCESS STEPS;
SI WAFER;
THRESHOLD VOLTAGE VARIATION;
TREATMENT PROCESS;
BORON;
DIGITAL DEVICES;
DRAIN CURRENT;
ELECTRIC PROPERTIES;
ELECTRON MOBILITY;
FLUORINE;
GALLIUM ALLOYS;
GALLIUM NITRIDE;
LEAKAGE CURRENTS;
OXYGEN;
PLASMA ETCHING;
SEMICONDUCTING SILICON COMPOUNDS;
SEMICONDUCTOR GROWTH;
SILICON;
SILICON WAFERS;
TRANSISTORS;
HIGH ELECTRON MOBILITY TRANSISTORS;
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EID: 77955831621
PISSN: 18626351
EISSN: 16101642
Source Type: Journal
DOI: 10.1002/pssc.200983644 Document Type: Conference Paper |
Times cited : (70)
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References (13)
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