New insights in critical solder joint location

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 977-982

  Modi, Mitul ^a   McCormick, Carolyn ^a   Armendariz, Norman ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CYCLING STRESS; NUMERICAL MODELS; SOLDER BALLS;

CRACK PROPAGATION; CRACKS; FAILURE ANALYSIS; FATIGUE OF MATERIALS; STRESS ANALYSIS; THERMAL CYCLING;

SOLDERED JOINTS;

EID: 24644482769     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Tunga, K., Pyland, J., Pucha, R. V., and Sitaraman, S., "Study on the Choice of Constitutive and Fatigue Models in Solder Joint Life Prediction," Proc. ASME IMECE, 2002.
2. Lee, W. W., Nguyen, L. T., and Selvaduray, G. S., "Solder Joint Fatigue Models: Review and Applicablity to Chip Scale Packages," Microelectronics Reliability, 2000, vol. 40, pp. 231-244.
3. Darveux, R. "Effect of simulation methodology on Solder Joint Crack Growth Correlation," Electronic Components and Technology Conference, 2000, pp. 1048-1058.
4. Johnson, Z., "Implementation of and Extension to Darveaux's Approach to Finite-Element Simulation of BGA Solder Joint Reliability," Electronic Compenents and Technology Conference, 1999, pp. 1190-1195.
5. Anderson, T., Barut, A., Guven, I., Madenci, E., "Revisit of Life-Prediction Model for Solder Joints," Electronic Compenents and Technology Conference, 2000, pp. 1064-1069.
6. Betty Phillips, Chew Chen Tay, Arlene Aguinaldo, Phil Butler and, Jim Maguire, "A New Approach to Quantify Solder Joint Reliability for BGA Components" Intel Assembly Test and Technology Journal, Volume 6, 2003.
7. Rebelo, N., Email Correspondance, April, 2004.