Alignment and performance considerations for capacitive, inductive, and optical proximity communication

IEEE Transactions on Advanced Packaging

Volumn 33, Issue 3, 2010, Pages 690-701

  Majumdar, Arka ^a   Cunningham, John E ^b   Krishnamoorthy, Ashok V ^b  

^a Stanford University   (United States)

^b Sun Labs   (United States)

Author keywords

Capacitance modeling; cross talk; Gaussian beam theory; misalignment; mutual inductance; packaging; proximity communication; wireless interconnects

Indexed keywords

CAPACITANCE MODELING; GAUSSIAN BEAM THEORY; MISALIGNMENT; MUTUAL INDUCTANCE; PROXIMITY COMMUNICATION; WIRELESS INTERCONNECTS;

ALIGNMENT; BIT ERROR RATE; CAPACITANCE; CHIP SCALE PACKAGES; COMMUNICATION; CROSSTALK; FITS AND TOLERANCES; GAUSSIAN BEAMS; GAUSSIAN NOISE (ELECTRONIC); INDUCTANCE; SIGNAL TO NOISE RATIO;

OPTICAL COMMUNICATION;

EID: 77955510038     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2010.2049355     Document Type: Article

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