TiN/TiC multilayer films deposited by pulse biased arc ion plating

Vacuum

Volumn 85, Issue 1, 2010, Pages 1-4

  Zhao, Yanhui ^a   Lin, Guoqiang ^b   Xiao, Jinquan ^a   Dong, Chuang ^b   Wen, Lishi ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

^b DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Film substrate adhesion; Microhardness; Pulse biased arc ion plating; TiN TiC multilayer films

Indexed keywords

DEPTH DISTRIBUTION; FILM/SUBSTRATE ADHESION; HIGH SPEED STEEL SUBSTRATE; MODULATION PERIOD; MODULATION STRUCTURE; PULSE BIASED ARC ION PLATING; PULSE BIASED ARC ION PLATINGS; SEM; TIN FILMS; TIN/TIC MULTILAYER FILMS;

ADHESION; AUGER ELECTRON SPECTROSCOPY; ION IMPLANTATION; MICROHARDNESS; MODULATION; MULTILAYERS; PLATING; SCANNING ELECTRON MICROSCOPY; TITANIUM CARBIDE; TITANIUM NITRIDE; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

MULTILAYER FILMS;

EID: 77955509007     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.vacuum.2009.04.043     Document Type: Article

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