In-situ metrology and testing of nanotwinned copper pillars for potential air gap applications

Microelectronic Engineering

Volumn 87, Issue 11, 2010, Pages 2046-2049

  Sriram, Vinay ^a   Yang, Jenn Ming ^a   Ye, Jia ^b   Minor, Andrew M ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b University of California Berkeley   (United States)

Author keywords

Air gap; Dislocations; In situ deformation; Nanometrology; Nanotwinned copper pillars

Indexed keywords

AIR-GAPS; COPPER PILLARS; DEFORMATION MECHANISM; IN-SITU; IN-SITU METROLOGY; IN-SITU STRESS MEASUREMENT; LINE STRUCTURES; MOLECULAR DYNAMIC SIMULATIONS; NANOMETROLOGY; NANOTWINNED COPPER; SEMICONDUCTOR INDUSTRY; TEM OBSERVATIONS; TRANSMISSION ELECTRON MICROSCOPE; TWIN BOUNDARIES;

COPPER; GRAIN BOUNDARIES; MOLECULAR DYNAMICS; SEMICONDUCTOR DEVICE MANUFACTURE; TEMPERATURE CONTROL; TRANSMISSION ELECTRON MICROSCOPY;

DEFORMATION;

EID: 77955509006     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2010.04.019     Document Type: Article

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