Visualization and minimization of disruptive bubble behavior in ultrasonic field

Ultrasonics

Volumn 50, Issue 8, 2010, Pages 798-802

  Kim, Wonjung ^a   Park, Keunhwan ^a   Oh, Jongkeun ^b   Choi, Jaehyuck ^b   Kim, Ho Young ^a,b  

^a Seoul National University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

Acoustic pressure; Adhesion force; Bubble oscillation; Ultrasonic cleaning

Indexed keywords

ACOUSTIC PRESSURES; ADHESION FORCES; BUBBLE BEHAVIOR; BUBBLE OSCILLATION; CLEANING EFFICIENCY; CLEANING SYSTEM; DIRECT VISUALIZATION; NANO PATTERN; NANO-SCALE PATTERNS; NOVEL PROCESS; PATTERN DAMAGES; RECENT TRENDS; SEMI-CONDUCTOR CLEANING; SEMI-CONDUCTOR WAFER; SUBMICRON-SIZED PARTICLES; SURFACE DAMAGES; ULTRASONIC FIELD; ULTRASONIC TECHNOLOGY; YIELD STRENGTH;

ACOUSTIC TRANSDUCERS; ADHESION; CLEANING; NANOPARTICLES; ULTRASONIC CLEANING; ULTRASONICS; VISUALIZATION;

OSCILLATING FLOW;

EID: 77955432629     PISSN: 0041624X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ultras.2010.04.002     Document Type: Article

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