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Volumn 48, Issue 5, 2002, Pages 401-406

Microstructure and strength of diffusion-bonded joints of TiAl base alloy to steel

Author keywords

Diffusion bonding; Microstructure; TiAl base alloy

Indexed keywords

DIFFUSION; EMBRITTLEMENT; INTERMETALLICS; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; STEEL; TENSILE STRENGTH; X RAY DIFFRACTION ANALYSIS;

EID: 0036662587     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1044-5803(02)00319-4     Document Type: Article
Times cited : (89)

References (9)
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    • Holmquist, M.1    Recina, V.2    Ockborn, J.3    Pettersson, B.4    Zumalde, E.5
  • 4
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    • (1995) High temperature ordered aluminides , pp. 499-505
    • Wickman, H.A.1    Wu, S.K.2
  • 6
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    • English letter
    • He P., Zhang J., Feng J., Qian Y. Diffusion bonding of TiAl to Ti and TC4 alloy. Acta Metall. Sin. 13:2000;162-167. [English letter].
    • (2000) Acta Metall. Sin. , vol.13 , pp. 162-167
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    • Interface structure and formation mechanism of diffusion-bonded SiC/TiAl joint
    • Liu H.J., Feng J.C., Qian Y.Y., Li Z.R. Interface structure and formation mechanism of diffusion-bonded SiC/TiAl joint. J. Mater. Sci. Lett. 18:1999;1011-1012.
    • (1999) J. Mater. Sci. Lett. , vol.18 , pp. 1011-1012
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  • 8
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    • Analysis of diffusion bond interface of TiAl base alloy with Ti, TC4 alloy and 40Cr steel
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  • 9
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.