Diffusion bonding of superplastic 7075 aluminium alloy

Materials Science and Engineering: A

Volumn 266, Issue 1-2, 1999, Pages 295-302

  Huang, Y ^a   Ridley, N ^a   Humphreys, F J ^a   Cui, J Z ^a  

^a UNIVERSITY OF MANCHESTER   (United Kingdom)

Author keywords

Bonding; Diffusion; Superplastic

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; DIFFUSION IN SOLIDS; GRAIN BOUNDARIES; GRAIN GROWTH; METALLOGRAPHIC MICROSTRUCTURE; ORGANIC COMPOUNDS; OXIDES; PRESSURE; SUPERPLASTICITY; SURFACES; TEMPERATURE;

DIFFUSION BONDING; INTERFACE GRAIN BOUNDARY MIGRATION; SURFACE OXIDE;

ALUMINUM ALLOYS;

EID: 0032661526     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(98)00958-7     Document Type: Article

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