SCOPUS 정보 검색 플랫폼

International Journal of Advanced Manufacturing Technology

Volumn 42, Issue 7-8, 2009, Pages 689-695

Developing diffusion bonding windows for joining AZ31B magnesium and copper alloys

(3) Mahendran, G a Balasubramanian, V b Senthilvelan, T c

a VRS College of Engineering and Technology (India)

b ANNAMALAI UNIVERSITY (India)

c PONDICHERRY ENGINEERING COLLEGE (India)

Author keywords

Copper alloy; Diffusion bonding; Magnesium alloy; Shear strength

Indexed keywords

BOND REGIONS; BONDING PRESSURE; BONDING PROCESS; BONDING QUALITY; BONDING TEMPERATURES; COMMERCIAL GRADE; CU ALLOY; HOLDING TIME; LAP SHEAR; MAGNESIUM SURFACE; METALLIC INTERLAYER; MICROSTRUCTURE ANALYSIS; OXIDE INCLUSION; PROCESS PARAMETERS; REFERENCE MAP; TENSILE TESTS;

ALLOYS; CERIUM ALLOYS; COPPER; COPPER ALLOYS; DIFFUSION; DIFFUSION BONDING; JOINING; MAGNESIUM; MAGNESIUM ALLOYS; MAGNESIUM PRINTING PLATES; METALLIC COMPOUNDS; OXIDE FILMS; SHEAR STRENGTH; TENSILE TESTING; WINDOWS;

DISSIMILAR MATERIALS;

EID: 67349258313 PISSN: 02683768 EISSN: 14333015 Source Type: Journal
DOI: 10.1007/s00170-008-1645-8 Document Type: Article

Times cited : (42)

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