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Materials Science and Engineering: A

Volumn 407, Issue 1-2, 2005, Pages 154-160

Diffusion bonding of commercially pure titanium to 304 stainless steel using copper interlayer

(6) Kundu, S a Ghosh, M b Laik, A c Bhanumurthy, K c Kale, G B c Chatterjee, S a

a INDIAN INSTITUTE OF ENGINEERING SCIENCE AND TECHNOLOGY (India)

b NATIONAL METALLURGICAL LABORATORY (India)

c BHABHA ATOMIC RESEARCH CENTRE (India)

Author keywords

Diffusion bonding; Interlayer; Intermetallic compounds

Indexed keywords

BOND STRENGTH (MATERIALS); COMPOSITION; COPPER; DIFFUSION; ENERGY DISPERSIVE SPECTROSCOPY; METALLOGRAPHIC MICROSTRUCTURE; PHASE DIAGRAMS; SCANNING ELECTRON MICROSCOPY; STAINLESS STEEL; TERNARY SYSTEMS; THERMAL EFFECTS; TITANIUM;

DIFFUSION BONDING; INTERLAYER; MATING SURFACE; TRANSITION JOINTS;

INTERMETALLICS;

INTERMETALLIC ALLOY;

EID: 27144544753 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2005.07.010 Document Type: Article

Times cited : (244)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.