Effects of mixed abrasive grits in slurries on free abrasive machining (FAM) processes

International Journal of Machine Tools and Manufacture

Volumn 50, Issue 9, 2010, Pages 843-847

  Bhagavat, Sumeet ^a   Liberato, Juan Carlos ^a   Chung, Chunhui ^a   Kao, Imin ^a  

^a STONY BROOK UNIVERSITY   (United States)

Author keywords

Grain size transition; Lapping; Mixed abrasive grits in slurries; Silicon wafer; Three body abrasion; Wafer production

Indexed keywords

GRAIN SIZE; GRAIN SIZE TRANSITION; MIXED ABRASIVE GRITS IN SLURRIES; THREE BODY ABRASION; WAFER PRODUCTION;

ABRASION; ANGULAR DISTRIBUTION; GRAIN SIZE AND SHAPE; LAPPING; METAL ANALYSIS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SURFACE PROPERTIES; SURFACE ROUGHNESS;

ABRASIVES;

EID: 77955313985     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2010.04.006     Document Type: Article

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