An analytical temperature prediction method for a chip power map

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2005, Pages 161-167

  Sikka, Kamal K ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GEOMETRY; HEAT RESISTANCE; HEAT TRANSFER; INTERFACES (MATERIALS); TEMPERATURE DISTRIBUTION; THERMOANALYSIS;

CHIP TEMPERATURE; HEAT TRANSFER RESISTANCES; POWER DISTRIBUTION; THERMAL INTERFACES;

MICROPROCESSOR CHIPS;

EID: 28144464311     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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