Development of a complete transient microchannel heat sink model

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 113-120

  Farnam, Dylan ^a   Sammakia, Bahgat ^a   Ghose, Kanad ^a  

^a State University of New York   (United States)

Author keywords

Hot spot; Numerical; Power map; Smart sink; Temperature gradient; Unsteady

Indexed keywords

COOLING; ELECTRONICS ENGINEERING; FIGHTER AIRCRAFT; FLOW OF FLUIDS; FORMING; HEAT EXCHANGERS; HEAT TRANSFER; HEATING EQUIPMENT; MICROPROCESSOR CHIPS; NUMERICAL METHODS; THERMOANALYSIS; THERMOMECHANICAL TREATMENT;

HOT SPOT; NUMERICAL; POWER MAP; SMART SINK; TEMPERATURE GRADIENT; UNSTEADY;

HEAT SINKS;

EID: 50949108157     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544261     Document Type: Conference Paper

References (21)

1. Qu, W., Mudawar, I., Lee, S., and Wereley, S.T., Experimental and Computational Investigation of Flow Development and Pressure Drop in a Rectangular Microchannel," ASME Journal of Electronic Packaging, vol. 128, no. 1, pp. 1-9, 2006.
2. Li, J., Peterson, G.P., Cheng, P., "Three-dimensional analysis of heat transfer in a micro-heat sink with single phase flow," International Journal of Heat and Mass Transfer, vol. 47, no. 19-20, pp. 4215-4231, 2004.
3. Tuckerman, D.B. and Pease, R.F.W., "High-performance heat sinking for VLSI," IEEE Electron Device Letters, vol. 2, no. 5, pp.126-129, May 1981.
4. Quadir, G.A., Beh, S.L., Seetharamu, K.N., and Hassan, A.Y., "A Transient Finite Element Analysis of Microchannel Heat Exchangers," International Journal of Heat Exchangers, vol. 3, no. 1, pp. 67-87, 2002.
5. Jiang, L., Wong, M., and Zohar, Y., "Unsteady characteristics of a thermal microsystem," Sensors and Actuators A: Physical, vol. 82, no. 1-3, pp. 108-113, May 2000.
6. Rao, P.S.C. and Rahman, M.M., "Transient Conjugate Heat-Transfer Model for Circular Tubes Inside a Rectangular Substrate," Journal of Thermophysics and Heat Transfer, vol. 20, no. 1, pp. 122-134, Mar. 2006.
7. Rujano, J.R. and Rahman, M.M., "Transient Response of Microchannel Heat Sinks in a Silicon Wafer," Journal of Electronic Packaging, vol. 119, no. 4, pp. 239-246, Dec. 1997.
8. Guo, Z. and Li, Z., "Size effect on single-phase channel flow and heat transfer at microscale," International Journal of Heat and Fluid Flow, vol. 24, no. 3, pp. 284-298, 2003.
9. Yitshak Zohar., Heat Convection in Micro Ducts, pp. 13, Kluwer Academic Publishers, Norwell, 2003.
10. Morini, G.L., "Single-phase convective heat transfer in microchannels: a review of experimental results," International Journal of Thermal Sciences, vol. 43, no. 7, pp. 631-651, 2004.
11. Morini, G.L., "Viscous heating in liquid flows in microchannels," International Journal of Heat and Mass Transfer, vol. 48, no. 17, pp. 3637-3647, 2005.
12. Xu, B., Ooi, K.T., Wong, N.T., and Choi, W.K., Experimental investigation of flow friction for liquid flow in microchannels," International Communications in Heat and Mass Transfer, vol. 27, no. 8, pp.1165-1176, 2000.
13. Herwig, H. and Hausner, O., "Critical view on 'new results in micro-fluid mechanics': an example," International Journal of Heat and Mass Transfer, vol. 46, no. 5, pp. 935-937, 2003.
14. Bavière, R., Favre-Marinet, M., and Le Person, S., "Bias effects on heat transfer measurements in microchannel flows," International Journal of Heat and Mass Transfer, vol. 49, no. 19-20, pp.3325-3337, 2006.
15. Kohl, M.J., Abdel-Khalik, S.I., Jeter, S.M., and Sadowski, D.L., "A microfluidic experimental platform with internal pressure measurements," Sensors and Actuators A: Physical, vol. 118, no. 2, pp.212-221, 2005.
16. Owhaib, W. and Palm, B., "Experimental investigation of single-phase convective heat transfer in circular microchannels," Experimental Thermal and Fluid Science, vol. 28, no. 2-3, pp.105-110, 2004.
17. Qu, W. and Mudawar, I., "Analysis of three-dimensional heat transfer in micro-channel heat sinks," International Journal of Heat and Mass Transfer, vol. 45, no. 19, pp.3973-3985, 2002.
18. FLUENT Version 6.3.26, ANSYS Inc., Canonsburg, PA, U.S.A.
19. FLUENT 6.3 User's Guide, ANSYS Inc., Canonsburg, PA, U.S.A.
20. R.K. Shah and A.L. London, Laminar Flow Forced Convection in Ducts: A Source Book for Compact Heat Exchanger Analytical Data, Academic, New York 1978.
21. Farnam, D.S., Sammakia, B., Ackler, H., and Ghose, K., "Comparative Analysis of Microchannel Heat Sink Configurations Subject to a Pressure Constraint," Journal of Heat Transfer Engineering, submitted Dec. 2007