Large area embedding for heterogeneous system integration

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 550-556

  Braun, T ^a   Becker, K F ^a   Bottcher L ^a   Bauer, J ^a   Thomas, T ^b   Koch, M ^a   Kahle, R ^a   Ostmann, A ^a   Aschenbrenner, R ^a   Reichl, H ^a   Brundel M ^c   Haag, J F ^c   Scholz, U ^c  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^c ROBERT BOSCH GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE COMPONENTS; CONDUCTOR LINES; COST-EFFECTIVE TECHNOLOGY; CU ETCHING; DIE PLACEMENT; EMBEDDED COMPONENTS; HETEROGENEOUS SYSTEMS; HIGH PRECISION; HIGH RELIABLE; LAND GRID ARRAYS; LARGE-AREA PROCESSING; LOW COST APPLICATIONS; LOW COSTS; MANUFACTURING TECHNOLOGIES; MATERIAL FLOW; MATERIAL PROPERTY; MEDIUM SIZE; MULTI-CHIP; NEW TECHNOLOGIES; NON DESTRUCTIVE; ON-WAFER; PACKAGING TECHNOLOGIES; PACKAGING TRENDS; PCB PROCESS; POLYMER APPLICATIONS; PRINTED CIRCUIT BOARD MANUFACTURING; PROCESS FLOWS; RECTANGULAR AREA; REDISTRIBUTION PROCESS; RELIABILITY POTENTIAL; RELIABILITY TESTING; RESIN COATED COPPER; SHIFT-AND; SINGLE CHIPS; SOLDERMASK; SURFACE FINISHES; TEMPERATURE CYCLING; TRANSFER MOLDING TECHNIQUE; VIA DRILLING; VIA FILLING; WAFER LEVEL; WARPAGES;

CHIP SCALE PACKAGES; DIES; EMBEDDED SYSTEMS; FAILURE MODES; LAMINATING; MICROELECTRONICS; PACKAGING; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; QUALITY ASSURANCE; RELIABILITY ANALYSIS; RESINS; TECHNOLOGY; TRANSFER MOLDING;

COMPRESSION MOLDING;

EID: 77955211512     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490916     Document Type: Conference Paper

References (8)

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