Embedding technologies for an automotive radar system

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1453-1459

  Becker, K F ^a   Koch, M ^a   Kahle, R ^a   Braun, T ^a   Bottcher L ^a   Ostmann, A ^a   Kostelnik, J ^b   Ebling, F ^b   Noack, E ^c   Sommer, J P ^c   Richter, M ^d   Schneider, M ^d   Reichl, H ^e  

^a FRAUNHOFER IZM   (Germany)

^b Wurth Electronics ^*  (Germany)

^c CWM GmbH   (Germany)

^d UNIVERSITY OF BREMEN   (Germany)

^e TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE BRAKES; ACTIVE SAFETY SYSTEMS; ADAPTIVE CRUISE CONTROL SYSTEMS; ANTENNA ELEMENT; AUTOMOTIVE RADAR SYSTEM; COLLISION WARNING; DRIVER ASSISTANCE SYSTEM; FURTHER DEVELOPMENT; HIGH FREQUENCY; IMPROVED RELIABILITY; IN-CHIP; MICROVIAS; PRODUCTION MODELS; RADAR SENSORS; RF CIRCUITRY; RF MODULE;

ADAPTIVE CONTROL SYSTEMS; AUTOMOBILE DRIVERS; AUTOMOBILE ELECTRONIC EQUIPMENT; AUTOMOBILE PARTS AND EQUIPMENT; COSTS; MICROWAVE CIRCUITS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; RADAR SYSTEMS; SENSORS; TECHNOLOGY; VEHICLES;

RADAR WARNING SYSTEMS;

EID: 70349682146     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074203     Document Type: Conference Paper

References (8)

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2. A. Ostmann; D. Manessis; A. Neumann; H. Reichl: Lamination technology for system-in-package manufacturing, Proc. Microtech 2007-IMAPS UK, 6-7 March, 2007:.
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8. M. D. Richter, K.-F. Becker, M. Schneider; Design of 77 GHz Interconnects for Active Chips Integrated Using Novel System¬in¬Package Technology; Proc. European Microwave Week 2008, Amsterdam, NL, 2008:.