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Volumn , Issue , 2010, Pages

Experimental investigation of hotspot removal using superlattice cooler

Author keywords

Hotspot; Microchannel heat sink; Solid state; Superlattice coolers; Thermal management

Indexed keywords

AMBIENT TEMPERATURES; EXPERIMENTAL INVESTIGATIONS; HIGH-PERFORMANCE MICROPROCESSORS; HOT SPOT; HOTSPOTS; HYBRID COOLING; HYBRID SCHEME; MICRO CHANNEL HEAT SINKS; MICROCHANNEL HEAT SINK; SOLID-STATE COOLING; THERMAL MANAGEMENT;

EID: 77955210553     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2010.5501255     Document Type: Conference Paper
Times cited : (14)

References (16)
  • 3
    • 0019563707 scopus 로고
    • High Performance heat sinking for VLSI
    • D. B. Tuckerman, and R. F. W. Pease, "High Performance heat sinking for VLSI," IEEE Electron Device Letters, vol. ED-2, no. 5, pp. 126-129, 1981.
    • (1981) IEEE Electron Device Letters , vol.ED-2 , Issue.5 , pp. 126-129
    • Tuckerman, D.B.1    Pease, R.F.W.2
  • 9
    • 0035822287 scopus 로고    scopus 로고
    • Prandtl-number effects and generalized correlations for confined and submerged jet impingement
    • C. Y. Li, and S. V. Garimella, "Prandtl-number effects and generalized correlations for confined and submerged jet impingement," International Journal of Heat and Mass Transfer, vol. 44, no. 18, pp. 3471-3480, 2001.
    • (2001) International Journal of Heat and Mass Transfer , vol.44 , Issue.18 , pp. 3471-3480
    • Li, C.Y.1    Garimella, S.V.2
  • 12
    • 33947312728 scopus 로고    scopus 로고
    • Nanoscale thermal transport and microrefrigerators on a chip
    • A. Shakouri, "Nanoscale thermal transport and microrefrigerators on a chip," Proceedings of the IEEE, vol. 94, no. 8, pp. 1613-1638, 2006.
    • (2006) Proceedings of the IEEE , vol.94 , Issue.8 , pp. 1613-1638
    • Shakouri, A.1
  • 15
    • 3142757031 scopus 로고    scopus 로고
    • Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding
    • F. J. Blanco, M. Agirregabiria, J. Garcia et al., "Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding," Journal of Micromechanics and Microengineering, vol. 14, no. 7, pp. 1047-56, 2004.
    • (2004) Journal of Micromechanics and Microengineering , vol.14 , Issue.7 , pp. 1047-1056
    • Blanco, F.J.1    Agirregabiria, M.2    Garcia, J.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.