Implementing spray cooling thermal management in high heat flux applications

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 699-701

  Cader, Tahir ^a   Tilton, Donald ^a  

^a Isothermal Systems Research   (United States)

Author keywords

1U servers; Air cooling; Heat flux; Heatsinks; Hotspots; Spray cooling

Indexed keywords

1U SERVERS; AIR-COOLING; HOT SPOTS; SPRAY COOLING;

BENCHMARKING; COMPUTER SIMULATION; COOLING SYSTEMS; ENERGY DISSIPATION; FINITE ELEMENT METHOD; HEAT RESISTANCE; HEAT SINKS; MICROPROCESSOR CHIPS; SEMICONDUCTOR MATERIALS; TEMPERATURE;

HEAT FLUX;

EID: 4444249110     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Ansari, S., Cader, T., Stoddard, N., Tolman, B., Frank, J., Cotton, D., Wong, T., and Pakdaman, N., 2003, "Spray cooling thermal management of a semiconductor chip undergoing probing, diagnostics, and failure analysis", Proceedings of InterPACKO3, Maui, Hawaii.
2. Cader, T., Harris, M.C, Tilton, T., and Tolman, B.H., 2003, "Spray Cooling Thermal Management for Semiconductor Chips Undergoing Bum-In," proceedings of InterPACK 2003, Maui, Hawaii.
3. Eiles, T.M., Hunt, D., and Chi, D., 2000, "Transparent Heat Spreader for Backside Optical Analysis of High Power Microprocessors," Proc. of ISTFA, pp. 547-551.
4. Intel, February 2004, "Intel Xeon Processors with 533 Front Side Bus at 2.0 GHz to 3.2 GHz" (ftp://download.intel.com/design/Xeon/datashts/ 25213506.pdf)
5. Tadayon, P., Q3 2000, "Thermal Challenges During Microprocessor Testing", Intel Technology Journal (Intel website).
6. Tilton, C., 2000, "Applying Mist to COTS Convection Modules is Really Cool," COTS Journal, Sept./Oct.