Silicon microrefrigerator

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 3, 2006, Pages 570-576

  Zhang, Yan ^a   Zeng, Gehong ^a   Shakouri, Ali ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Cooling; Cooling power density; Hot spot cooling; Microrefrigerator; Silicon; Three dimensional (3 D) microrefrigerator

Indexed keywords

COMPUTER SIMULATION; COOLING; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE; REFRIGERATORS; SEMICONDUCTING SILICON; SUBSTRATES; THERMOELECTRICITY;

COOLING POWER DENSITY; FINITE ELEMENT ELECTROTHERMAL MODEL; MICROREFRIGERATOR;

CHIP SCALE PACKAGES;

EID: 33748519886     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.880508     Document Type: Article

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