Filter integration in ultra thin organic substrate via 3D stitched capacitor

2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009

Volumn , Issue , 2009, Pages

  Min, Sunghwan ^a   Hwang, Seunghyun ^a   Chung, Daehyun ^a   Swaminathan, Madhavan ^a   Sridharan, Vivek ^a   Chan, Hunter ^a   Liu, Fuhan ^a   Sundaram, Venky ^a   Tummala, Rao R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MEASURED RESULTS; ORGANIC SUBSTRATE; PARASITICS; RETURN LOSS; SIMULATED RESULTS; TUNABLE CAPACITORS; ULTRA-THIN;

CAPACITANCE; CAPACITORS; CHIP SCALE PACKAGES; DESIGN; PACKAGING; THREE DIMENSIONAL;

BANDPASS FILTERS;

EID: 77950190730     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EDAPS.2009.5404004     Document Type: Conference Paper

References (13)

1. Rao R. Tummala and Madhavan Swaminathan, Introduction to Systemon-Package (SOP), McGraw-Hill, 2008.
2. Clyde F. Coombs, Jr, Printed Circuits Handbook, McGraw-Hill, 2008.
3. Rao R. Tummala and Joy Laskar, "Gigabit wireless SOP technology," IEEE Proceeding, vol.92, pp. 376-387, Feb. 2004
4. Lap K. Yeung, Ke-Li Wu, and Yuanxum E. Wang, "Low-temperature cofired ceramic LC filters for RF applications," IEEE Magazine, pp. 118-128, Oct. 2008.
5. M. Swaminathan, et al., "Design and fabrication of integrated RF modules in liquid crystalline polymer (LCP) substrates," 32nd Annual Conference of IEEE Industrial Electronics Society, Nov. 2005
6. S.-H. Min, et al., "RF design methodology for design-cycle-time reduction using parameterization of embedded passives on multilayer organic substrates," IEEE MTT-S Digest, pp. 1397-1400, June 2008.
7. D. Thompson, et al., "Characterization of liquid crystal polymer (LCP) material and transmission lines on LCP substrates from 30-110 GHz," IEEE Trans. on Microwave Theory Tech., vol.52, pp. 1343-1352, April 2004
8. V. Sundaram, et al., "Super high density two metal layer ultra-thin organic substrates for next generation system-on-package (SOP), SiP and ultra-fine pitch flip-chip packages," in Pan Pacific Microelectronics Symposium, Hawaii, 2009
9. J.-S. Hong and M. J. Lancaster, Microstrip Filters for RF/Microwave Applications John Wiley & Sons, Inc., 2001.
10. J. Kolstad, et al., "A new circuit augmentation method for modeling of interconnects and passive components," IEEE Trans. on Advanced Packaging, vol.29, no.1, pp. 67-77, Feb. 2006.
11. S. Hwang, et al., "Characterization of next generation thin low-K and low-loss organic dielectrics from 1 to 110 GHz" accepted for publication on IEEE Advanced Packaging, 2009
12. Agilent ADS, www.agilent.com
13. Sonnet EM, www.sonnetusa.com