Improving humidity bond reliability of copper bonding wires

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1725-1732

  Uno, Tomohiro ^a   Yamada, Takashi ^b  

^a NIPPON STEEL CORPORATION   (Japan)

^b Nippon Micrometal Corporation   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BOND INTERFACE; BONDABILITY; BONDING WIRES; CORROSION-INDUCED DETERIORATION; COST SAVING; ELECTRICAL AND MECHANICAL PROPERTIES; HUMID ENVIRONMENT; INTERMETALLIC COMPOUNDS; MOLDING RESIN; RELIABILITY TESTING; ROOT CAUSE OF FAILURES; WIRE BONDING; WIRE BONDS;

BROMINE COMPOUNDS; CHLORINE COMPOUNDS; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; FAILURE ANALYSIS; INTERMETALLICS; MECHANICAL PROPERTIES; MOISTURE; PALLADIUM; RESINS;

WIRE;

EID: 77955182115     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490741     Document Type: Conference Paper

References (13)

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