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Volumn 34, Issue 3, 2005, Pages 497-500
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Study of a new type of Au-Ag-Si intermediate temperature eutectic solder
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Author keywords
Au Ag Si; Solder; Wettability
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Indexed keywords
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EID: 17244364084
PISSN: 1002185X
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (15)
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References (7)
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