Microstructure and shear strength of solder joints of SiCp/Al composites with Ni plating with Sn-2.5Ag-2.0Ni solder

Beijing Keji Daxue Xuebao/Journal of University of Science and Technology Beijing

Volumn 31, Issue 7, 2009, Pages 884-889

  Wu, Mao ^a   He, Xin Bo ^a   Meng, Fei Fei ^a   Qu, Xuan Hui ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Aging treatment; Intermetallic compounds; SiCp Al composites; Solder; Solder joint

Indexed keywords

AGING TREATMENT; INTERMETALLIC COMPOUNDS; SICP/AL COMPOSITES; SOLDER; SOLDER JOINT;

ALUMINUM; MICROSTRUCTURE; NICKEL; REACTION RATES; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SILICON CARBIDE; SILVER; SOLDERING ALLOYS;

TIN;

EID: 70350247619     PISSN: 1001053X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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