Electrical and thermal behaviour of nanopackaging interconnects with conventional and innovative materials

2010 IEEE 14th Workshop on Signal Propagation on Interconnects, SPI 2010 - Proceedings

Volumn , Issue , 2010, Pages 79-82

  Chiariello, A G ^a   Maffucci, A ^b   Miano, G ^a  

^a UNIVERSITY OF NAPLES FEDERICO II   (Italy)

^b UNIVERSITY OF CASSINO AND SOUTHERN LAZIO   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP TO PACKAGES; CONDUCTING CHANNELS; EFFECTS OF TEMPERATURE; INNOVATIVE MATERIALS; MEAN FREE PATH; NANO-PACKAGING; PARASITIC RESISTANCES; THERMAL BEHAVIOURS;

CARBON NANOTUBES;

EID: 77954419842     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SPI.2010.5483568     Document Type: Conference Paper

References (13)

1. Morris, J.E., Nanopackaging: Nanotechnologies and electronics packaging, Springer (New-York, 2008).
2. ITRS, International Technology Roadmap for Semiconductors, Edition 2007, http://public.itrs.net.
3. Beausoleil, R.G. et al.,"Nanoelectronic and nanophotonic interconnect," Proc. IEEE, Vol.96 (2008), pp. 230-247.
4. Aggarwal A.O., et al., "Thermomechanical reliability of Nickel Pillar Interconnections Replacing Flip-Chip Solder Withouth Underfill", IEEE Trans. on Electr. Packag. Manuf., Vol.31, n.4 (2008), pp. 341-354.
5. Kumbhat, N. et al., "Highly-Reliable, 30μm Pitch Copper Interconnects Using Nano-ACF/NCF", Electr. Components Techn. Conf., ECTC (2008), pp.1479-1485.
6. Soga I. et al., "Carbon nanotube bumps for LSI interconnect," Electronic Components and Technology Conf., ECTC (2008), pp.1390-1394.
7. Maffucci, A., "Carbon Nanotubes in Nanopackaging Applications, IEEE Nanotechnology Magazine, Vol.3 n.3, (2009), pp. 22-25.
8. Lin, W. and Wong, C. P., "Vertically aligned carbon nanotubes on copper substrates for applications as thermal interface materials: From synthesis to assembly," IEEE Nanotech., Genova, Italy (2009), pp. 416 - 421.
9. Maffucci, A., Miano, G. and Villone, F., "A new Circuit Model for Carbon Nanotube Interconnects with Diameter-dependent Parameters," IEEE Transactions on Nanotechnology, Vol.8 (2009), pp. 345-354.
10. Forestiere, C., Maffucci, A., Maksimenko, S.A., Miano G., and Slepyan, G.Y., "Signal Propagation in Carbon Nanotubes of Arbitrary Chirality," to be published in IEEE Trans. on Nanotechnology, available on-line.
11. Chiariello, A.G., et al., "Carbon Nanotubes Interconnects for Nanoelectronics Circuits", in Carbon nanotubes, INTECH (Vienna, Austria, 2010).
12. Steinhögl W. et al., "Comprehensive study of the resistivity of copper wires with lateral dimensions of 100 nm and smaller," Journal of Applied Physics, Vol.97 (2005), pp.023706/1-7.
13. Naeemi, A. and Meindl, J.D., "Performance Modeling for Single- and Multiwall Carbon Nanotubes," IEEE Trans. on Electron Dev., Vol.55 (2008) pp. 2574-2582.