Vertically aligned carbon nanotubes on copper substrates for applications as thermal interface materials: From synthesis to assembly

2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009

Volumn , Issue , 2009, Pages 416-421

  Lin, Wei ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA LAYERS; ASSEMBLING PROCESS; CHEMICAL ANCHORING; COEFFICIENT OF THERMAL EXPANSION; CONTACT THERMAL RESISTANCE; COPPER SUBSTRATES; DIRECT SYNTHESIS; ELECTRONIC PACKAGING; EQUIVALENT THERMAL; GROWTH SUBSTRATES; HIGH QUALITY; HIGH TEMPERATURE; HIGH THERMAL; INTERFACE MODIFICATION; INTERFACIAL THERMAL RESISTANCE; ORDER OF MAGNITUDE; ORDERS OF MAGNITUDE; PHOTONIC PACKAGING; SI SUBSTRATES; SILICON CHIP; SUBSTRATE INTERFACE; SUPPORT LAYER; THERMAL INTERFACE MATERIALS; THERMAL INTERFACES; THERMAL MANAGEMENT; THERMAL TRANSPORT; VERTICALLY ALIGNED; VERTICALLY ALIGNED CARBON NANOTUBE;

CARBON NANOTUBES; CHEMICAL STABILITY; CHIP SCALE PACKAGES; COPPER; MICROELECTRONICS; MODEL PREDICTIVE CONTROL; NANOTECHNOLOGY; PREDICTIVE CONTROL SYSTEMS; SYNTHESIS (CHEMICAL); TECHNOLOGICAL FORECASTING; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMAL INSULATING MATERIALS; THERMOANALYSIS;

SUBSTRATES;

EID: 77950979017     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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