Micromachined RF devices for concurrent integration on dielectric-air-metal structures

IEICE Transactions on Electronics

Volumn E93-C, Issue 7, 2010, Pages 1111-1118

  Nishino, Tamotsu ^a   Hangai, Masatake ^a   Yoshida, Yukihisa ^a   Lee, Sang Seok ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

Filters; GCPW; Hollow waveguides; Hybrids; MEMS; MEMS switches; Micromachine; Silicon

Indexed keywords

ELECTRIC SWITCHES; ELECTROMECHANICAL DEVICES; FILTERS (FOR FLUIDS); MEMS; MICROMACHINING; SILICON; SILICON WAFERS; WAFER BONDING; WAVEGUIDES;

DIELECTRIC-AIR-METAL STRUCTURES; GCPW; HOLLOW WAVEGUIDES; HYBRIDS; MEMS SWITCHES; MICRO ELECTROMECHANICAL SYSTEM (MEMS); RADIO FREQUENCIES; WAFER BONDING PROCESS;

WAVEGUIDE FILTERS;

EID: 77954400571     PISSN: 09168524     EISSN: 17451353     Source Type: Journal    
DOI: 10.1587/transele.E93.C.1111     Document Type: Article

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