Systematic characterization of embossing processes for LTCC tapes

Journal of Microelectronics and Electronic Packaging

Volumn 5, Issue 4, 2008, Pages 142-149

  De Torres, Heike Bartsch ^a   Gade, Robert ^a   Albrecht, Arne ^a   Hoffmann, Martin ^a  

^a ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Design of experiments; Embossing; LTCC; Micro valves; Sealing; Viscoelastic properties

Indexed keywords

DESIGN OF EXPERIMENTS; FRICTION; SEALING (FINISHING); STABILITY CRITERIA; VISCOELASTICITY;

EMBOSSING; LTCC; MICRO VALVES; OPTIMUM PARAMETERS; POSITION TOLERANCES; PROCESS PARAMETERS; RHEOLOGICAL MEASUREMENTS; VISCOELASTIC PROPERTIES;

MOLDING;

EID: 77954244624     PISSN: 15514897     EISSN: None     Source Type: Journal    
DOI: 10.4071/1551-4897-5.4.142     Document Type: Article

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