Hot embossing - An alternative method to produce cavities in ceramic multilayer

IMAPS/ACerS - 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2006

Volumn , Issue , 2006, Pages 67-74

  Rabe, Torsten ^a   Kuchenbecker, Petra ^a   Schulz, Baerbel ^a   Schmidt, Martin ^b  

^a BAM FEDERAL INSTITUTE FOR MATERIALS RESEARCH AND TESTING   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

Ceramic multilayer; Hot embossing; Lamination; LTCC; Zero shrinkage sintering

Indexed keywords

CERAMIC MULTILAYERS; HOT-EMBOSSING; LAMINATION; LTCC; LTCC (LOW TEMPERATURE CO-FIRED CERAMIC); MICROSTRUCTURAL DEFECTS; ULTRA PRECISION MILLINGS; ULTRASOUND MICROSCOPY;

CERAMIC MATERIALS; EXHIBITIONS; LAMINATES; LAMINATING; MICROELECTRONICS; MICROSYSTEMS; OPTICAL MULTILAYERS; SHRINKAGE; SINTERED ALUMINA; SINTERING; TECHNOLOGY; ULTRASONIC APPLICATIONS;

MULTILAYERS;

EID: 84878236909     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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