Interfacial voids in aluminum created by aqueous dissolution

Electrochimica Acta

Volumn 55, Issue 20, 2010, Pages 6093-6100

  Adhikari, S ^a   Chumbley, L S ^a,b   Chen, H ^c   Jean, Y C ^c   Geiculescu, A C ^d   Hillier, A C ^a   Hebert, K R ^a  

^a Iowa State University of Science and Technology   (United States)

^b U S DEPARTMENT OF ENERGY   (United States)

^c UNIVERSITY OF MISSOURI KANSAS CITY   (United States)

^d CRMD   (United States)

Author keywords

Aluminum; Corrosion; Positron annihilation; Transmission electron microscopy; Voids

Indexed keywords

AQUEOUS DISSOLUTION; CALCULATED VALUES; DIFFUSION COEFFICIENTS; ELEVATED CONCENTRATIONS; INTERFACIAL VOIDS; METAL SURFACES; NANO-METER-SCALE; NUMBER DENSITY; RAPID NUCLEATION; ROOM TEMPERATURE; VACANCY CONCENTRATION; VACANCY DEFECTS; VOID LAYER; VOID RADIUS;

ALUMINUM; ATOMIC FORCE MICROSCOPY; ATOMIC SPECTROSCOPY; CORROSION; DISSOLUTION; ELECTRONS; METAL RECOVERY; POSITRON ANNIHILATION; POSITRON ANNIHILATION SPECTROSCOPY; SURFACE DEFECTS; TRANSMISSION ELECTRON MICROSCOPY; VACANCIES;

SCANNING ELECTRON MICROSCOPY;

EID: 77954175692     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2010.05.073     Document Type: Article

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