Behavior of copper and lead during heat-treatment and surface treatment of aluminium capacitor foils

Journal of the Electrochemical Society

Volumn 146, Issue 4, 1999, Pages 1380-1385

  Ashitaka, Z ^a   Thompson, G E ^a   Skeldon, P ^a   Wood, G C ^a   Shimizu, K ^b  

^a UNIVERSITY OF MANCHESTER   (United Kingdom)

^b KEIO UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ANODIC POLARIZATION; COPPER; ELECTROLYTIC POLISHING; ETCHING; FILMS; HEAT TREATMENT; LEAD; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SECONDARY ION MASS SPECTROMETRY; SURFACE TREATMENT; TRANSMISSION ELECTRON MICROSCOPY;

ATOMIC ABSORPTION SPECTROSCOPY; PLASMA SPECTROSCOPY; TUNNEL ETCHING;

ELECTROLYTIC CAPACITORS;

EID: 0032642455     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1391774     Document Type: Article

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