A simple thermal model for multi-core processors and its application to slack allocation

Proceedings of the 2010 IEEE International Symposium on Parallel and Distributed Processing, IPDPS 2010

Volumn , Issue , 2010, Pages

  Wang, Zhe ^a   Ranka, Sanjay ^a  

^a UNIVERSITY OF FLORIDA   (United States)

Author keywords

DVS; Multi core processor; Slack allocation; Thermal model; Thermal aware scheduling

Indexed keywords

COMPUTATIONAL COSTS; DIRECTED ACYCLIC GRAPHS; HEAT DENSITY; HIGH TEMPERATURE; HOT-SPOT MODEL; MATRIX; MATRIX MODEL; MOORE'S LAW; MULTI-CORE PROCESSOR; ON CHIPS; PEAK TEMPERATURES; POWER CONSUMPTION; POWER DENSITIES; SIMULATION RESULT; SLACK ALLOCATION; TEMPERATURE PROFILES; THERMAL MODEL;

CHIP SCALE PACKAGES; DISTRIBUTED PARAMETER NETWORKS; NANOTECHNOLOGY; PROGRAM PROCESSORS; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

COMPUTER SIMULATION;

EID: 77953973136     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IPDPS.2010.5470426     Document Type: Conference Paper

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