Test structures for characterization of thermal-mechanical stress in 3D stacked IC for analog design

IEEE International Conference on Microelectronic Test Structures

Volumn , Issue , 2010, Pages 140-144

  Minas, Nikolaos ^a   Van Der Plas, Geert ^a   Oprins, Herman ^a   Yang, Yu ^b   Okoro, Chuckwudi ^b   Mercha, Abdelkarim ^a   Cherman, Vladimir ^a   Torregiani, Cristina ^a   Perry, Dan ^c   Cupac, Miro ^a   Rakowski, Michal ^a   Marchal, Pol ^a  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c QUALCOMM INC   (United States)

Author keywords

3D; Analog devices; Digital to analog converters; Thermal mechanical stress

Indexed keywords

ANALOG DESIGN; ANALOG DEVICES; DIGITAL-TO-ANALOG CONVERTERS; HOTSPOTS; ION CHANGE; MEASUREMENT TECHNIQUES; MECHANICAL STRESS; STAND -ALONE; TEST STRUCTURE;

CARRIER MOBILITY; DIGITAL DEVICES; DIGITAL TO ANALOG CONVERSION; MICROELECTRONICS; MOS DEVICES; STRESSES; TESTING; THREE DIMENSIONAL;

DIGITAL INTEGRATED CIRCUITS;

EID: 77953899468     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMTS.2010.5466836     Document Type: Conference Paper

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